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    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

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    illustration of packaged SMD power inductors on a four-wire cryogenic characterization board

    Cryogenic SMD Inductors at 4 K: Low DCR, Persistent AC Loss

    Wk 43 Electronics Supply Chain Digest

    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

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    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

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    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

    SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

    illustration of packaged SMD power inductors on a four-wire cryogenic characterization board

    Cryogenic SMD Inductors at 4 K: Low DCR, Persistent AC Loss

    Wk 43 Electronics Supply Chain Digest

    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

    TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

    Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

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Wk 22 Electronics Supply Chain Digest

3.6.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 5-31-24.

DATAPOINT OF THE WEEK: China retail auto sales from May 1s to 26th totaled 1.208M, down 6% Y/Y and down 2% down vs the same period last month according to data from the China Passenger Car Association (CPCA).

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For the same period NEV retail sales stood at 574K units, up 27% Y/Y and up 2% from the same period last month. The data indicates a relative slowdown in China retail sales in the 2H of the month compared to the 1H.

Headlines:

Auto

  • BYD unveils new hybrid tech with range of 2,100 km; concerns it could spark another round of price competition in China
  • Americans still prefer gas vehicles over hybrid or EVs, study shows
  • Renault to develop Twingos priced under 20,000 euros with Chinese partner
  • China’s EV makers aim to take share in Europe with new low cost models and heavy spend on sales and marketing
  • Toyota’s global volumes fall in April, led by drops in China and Japan
  • China gears up to make a deal with Europe as EV tariffs loom
  • The EV race has become a cost cutting race says Stellantis CEO
  • VW says it will build €20,000 BEVs alone after Renault talks collapsed

IP&E

  • MLCC shipments expected to increase by 6.8% in Q2 thanks to strong AI server demand, says TrendForce
  • Yageo sees inventory in the supply chain approaching healthy levels

Datacenter

  • Amazon in talks with Italy to invest billions of euros in cloud plan
  • Strong AI server demand for Dell but competitive pressure drags profitability

Semiconductors

  • China sets up third fund with $47.5B to boost semiconductor sector
  • Micron to build new DRAM plant in Hiroshima.
  • SiC substrate prices continue to decline in China, says DigiTimes
  • Marvell issued weak July-Q outlook on continued inventory digestion in Cloud and Telco
  • EU approves Italian aid for $5.4B STMicro chip plant
  • Activist investor Elliot Management takes $2.5B stake in Texas Instruments; urges the company to rein in capital investments and improve cash flow

Other

  • Gartner forecasts AI PCs reaching 100% penetration in commercial PCs by 2026
  • HPE beats revenue expectations on 7% increase in PC units; projects 10% of PCs being AI in 2H24

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Source: Edgewater Research

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