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    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Wk 36 Electronics Supply Chain Digest

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    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

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    Samsung Electro-Mechanics low-profile and embedded MLCCs for compact PCB and power-delivery applications

    Samsung Low-Profile and Embedded MLCCs for Compact Devices

    Wk 36 Electronics Supply Chain Digest

    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

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Wk 31 Electronics Supply Chain Digest

10.8.2026
Reading Time: 4 mins read
A A


Electronics Supply Chain Weekly Digest 8-7-26.

DATAPOINT OF THE WEEK: S&P reported July Eurozone mfg PMI increase to 51.9 from 51.4 in June, remaining in expansion for the sixth consecutive month, with production rising at its fastest rate in 4.5 years , though new order growth was minimal and raises concerns that the strong production growth may be short lived.

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Germany’s July mfg PMI soared to 52.2 from 50.3 in June, remaining in expansion as production, similar to the Eurozone PMI, rose at its fastest rate in 4.5 years, with a notable improvement in export sales. S&P reported US mfg PMI did not change in July from the 53.9 reported in June, marking the twelfth straight month of expansion but production rose slower than previous month driven by third straight month of weakened growth in new orders.

ISM US mfg PMI rose to 55.6 from 53.3 in June. RatingDog China mfg PMI declined to 50.9 from 51.7 in June, but the eighth straight month of expansion and, as the pace of new order and output growth continued to decelerate to four-month lows. China’s Government mfg PMI declined into contraction territory of 49.2 from 50.3 in June.

Auto/Transportation

  • Ford unveils Fathom EV pickup truck at sub-$30K on new California-designed platform
  • GM renews SAIC JV for 20 years, turning China into an export hub for Buick and Cadillac
  • Honda raises FY27 operating profit outlook 30% on motorcycle strength and US hybrid demand, shelves Canada EV battery plans
  • Tesla’s China-made EV sales climb 37.8% Y/Y in July, extending growth streak to nine months as BYD outsells globally
  • Uber commits over $10B to robotaxi push through investments
  • Amazon’s Zoox announces paid robotaxi launch in Las Vegas next week after NHTSA clears purpose-built vehicle for commercial deployment

Connectivity

  • TE Connectivity announces acquisition of HENN Connector Group’s plastic air and fluid connection unit to bolster EV thermal management portfolio
  • US FCC drafts rule to block new-model Chinese optical transceivers, threatening AI datacenter buildouts reliant on China capacity, according to TrendForce

Industrial

  • Airbus posts flat July deliveries, requiring a 90-jets-per-month pace needed moving forward to hit 870 full-year target
  • Honeywell Aerospace cuts 2026 sales growth outlook to 4-5% as supply constraints divert output to Boeing from higher-margin aftermarket

Semiconductors

  • AMD announces agreement to acquire Taalas to add hardwired inference silicon alongside its Instinct GPU roadmap
  • Anthropic builds in-house silicon team to co-design custom chips for Claude, easing AI compute bottleneck
  • CXMT reportedly wins DRAM sockets at HP, Asus, and Acer notebooks despite US Pentagon blacklist risk
  • Foxconn July revenue hits record on AI server pull-in, guiding 3Q growth as rack shipments accelerate
  • Global semiconductor sales jump 35.1% Q/Q in 2Q26 to $403.3B as Americas lead 160.9% Y/Y June surge, according to SIA
  • GlobalFoundries reports 2Q results ahead of expectations as AI datacenter demand lifts silicon photonics sales
  • Infineon guides C3Q revenue above expectations as AI datacenter power chip demand outstrips supply and 2027 forecast set for hike
  • Microchip guides C3Q revenue and profit above expectations on AI datacenter, industrial, automotive, and aerospace demand
  • Japan and Korea MLCC makers push blanket 30% 2H26 price hike as AI server demand strips high-end capacity, according to TrendForce
  • Nokia announces acquisition of NXP’s Chandler, Arizona fab to convert into InP optical chip capacity for AI datacenter demand
  • onsemi reports $1.6B in 2Q revenue and guides 3Q above expectations as AI datacenter power chip revenue set to more than double in 2026
  • SK Hynix announces $38B South Korea fab expansion to double memory capacity as AI demand sells out through 2027
  • SpaceX and Tesla commit initial $16.8B to Terafab, targeting 1 terawatt of internal AI compute
  • Wolfspeed announces LITEON design win with SiC MOSFETs qualified into 800V power sidecar and rack PSU platforms for hyperscale AI datacenters

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