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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

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    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

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Wk 37 Electronics Supply Chain Digest

23.9.2024
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 9-13-24.

DATAPOINT OF THE WEEK: Infineon announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.

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August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.

Headlines:

Auto

  • BYD lifts its 2024 sales target to 4m units from 3.6m prior
  • BMW trims 2024 profit on technical issue, weak China demand; revises shipments target lower
  • BMW, Toyota aim to make hydrogen-powered EVs mainstream with partnerships
  • EU to trim proposed tariffs on Tesla, other EVs from China
  • Italy seeks early review of EU’s 2035 combustion engine ban
  • Panasonic Energy prepares for high-capacity EV battery production
  • European automakers could face billions in fines for missing 2025 emissions target, Renault CEO says
  • VW CEO Blume says European market shrinking amid tougher competition
  • Spanish Prime Minister Sanchez says EU should rethink China EV tariff plan
  • Geely is scouting locations for Europe plant amid EU-China tariffs dispute
  • Honda cuts jobs in China, suspends production at three plants
  • Volvo Truck delays construction of battery plant in Sweden
  • New-vehicle prices continue to tumble in August, incentives Uu nearly 50% Y/Y says Cox
  • US House passes bill targeting China that would limit EV tax credits

Industrial

  • China grows its dominance in the global supply of solar panels

Datacenter

  • Dell sees job cuts continuing amid marging pressure from AI servers and weak PC demand

Semiconductors

  • ASML needs licence to service some equipment in China, Dutch government says
  • Intel’s CHIPS Act fund delayed by officials — Washington reportedly wants more information before disbursing billions of dollars
  • TSMC August revenue grows 33% Y/Y
  • GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
  • Vietnam to roll out chip incentive subsidy policy
  • Mobileye to cease LIDAR development
  • NXP to invest more than $1 bln in India as it boosts R&D efforts
  • Samsung Electronics plans global job cuts of up to 30% in some divisions
  • Samsung Electronics withdraws personnel from Taylor fab amid 2nm yield issues
  • Tesla’s Dojo 2 expected to be mass produced by the end of 2025; Dojo 3 slated for 2026

Other

  • Apple announces its next-gen iPhone 16, smartwatch and AirPods; iPhone AI features set to roll out over time
  • Huawei launches tri-foldable phone; touts 4 million pre-orders
  • East Coast and Gulf Coast dockworkers bracing for a strike at major American Ports
  • AI PCs fail to boost 2H24 notebook shipments despite launch
  • European firms more wary of investing in China says lobby group
  • US businesses’ optimism in China falls to record low, survey shows

Related

Source: Edgewater Research

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