Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 37 Electronics Supply Chain Digest

23.9.2024
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 9-13-24.

DATAPOINT OF THE WEEK: Infineon announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.

RelatedPosts

Wk 39 Electronics Supply Chain Digest

Wk 38 Electronics Supply Chain Digest

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.

Headlines:

Auto

  • BYD lifts its 2024 sales target to 4m units from 3.6m prior
  • BMW trims 2024 profit on technical issue, weak China demand; revises shipments target lower
  • BMW, Toyota aim to make hydrogen-powered EVs mainstream with partnerships
  • EU to trim proposed tariffs on Tesla, other EVs from China
  • Italy seeks early review of EU’s 2035 combustion engine ban
  • Panasonic Energy prepares for high-capacity EV battery production
  • European automakers could face billions in fines for missing 2025 emissions target, Renault CEO says
  • VW CEO Blume says European market shrinking amid tougher competition
  • Spanish Prime Minister Sanchez says EU should rethink China EV tariff plan
  • Geely is scouting locations for Europe plant amid EU-China tariffs dispute
  • Honda cuts jobs in China, suspends production at three plants
  • Volvo Truck delays construction of battery plant in Sweden
  • New-vehicle prices continue to tumble in August, incentives Uu nearly 50% Y/Y says Cox
  • US House passes bill targeting China that would limit EV tax credits

Industrial

  • China grows its dominance in the global supply of solar panels

Datacenter

  • Dell sees job cuts continuing amid marging pressure from AI servers and weak PC demand

Semiconductors

  • ASML needs licence to service some equipment in China, Dutch government says
  • Intel’s CHIPS Act fund delayed by officials — Washington reportedly wants more information before disbursing billions of dollars
  • TSMC August revenue grows 33% Y/Y
  • GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
  • Vietnam to roll out chip incentive subsidy policy
  • Mobileye to cease LIDAR development
  • NXP to invest more than $1 bln in India as it boosts R&D efforts
  • Samsung Electronics plans global job cuts of up to 30% in some divisions
  • Samsung Electronics withdraws personnel from Taylor fab amid 2nm yield issues
  • Tesla’s Dojo 2 expected to be mass produced by the end of 2025; Dojo 3 slated for 2026

Other

  • Apple announces its next-gen iPhone 16, smartwatch and AirPods; iPhone AI features set to roll out over time
  • Huawei launches tri-foldable phone; touts 4 million pre-orders
  • East Coast and Gulf Coast dockworkers bracing for a strike at major American Ports
  • AI PCs fail to boost 2H24 notebook shipments despite launch
  • European firms more wary of investing in China says lobby group
  • US businesses’ optimism in China falls to record low, survey shows

Related

Source: Edgewater Research

Recent Posts

Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
1
ECIA September 2026 Industry Pulse electronic component trends and sentiment report

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

12.10.2026
0

Wk 39 Electronics Supply Chain Digest

10.10.2026
8
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
30
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
7
Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

7.10.2026
13
Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

TDK Expands1608 Inductors for Automotive PoC Filters

6.10.2026
11
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
43
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
36

Upcoming Events

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved