Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Modelithics Releases COMPLETE v26.1 for Keysight ADS

    April 2026 Interconnect, Passives and Electromechanical Components Market Insights

    SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem

    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 37 Electronics Supply Chain Digest

23.9.2024
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 9-13-24.

DATAPOINT OF THE WEEK: Infineon announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.

RelatedPosts

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 16 Electronics Supply Chain Digest

Wk 15 Electronics Supply Chain Digest

Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.

Headlines:

Auto

  • BYD lifts its 2024 sales target to 4m units from 3.6m prior
  • BMW trims 2024 profit on technical issue, weak China demand; revises shipments target lower
  • BMW, Toyota aim to make hydrogen-powered EVs mainstream with partnerships
  • EU to trim proposed tariffs on Tesla, other EVs from China
  • Italy seeks early review of EU’s 2035 combustion engine ban
  • Panasonic Energy prepares for high-capacity EV battery production
  • European automakers could face billions in fines for missing 2025 emissions target, Renault CEO says
  • VW CEO Blume says European market shrinking amid tougher competition
  • Spanish Prime Minister Sanchez says EU should rethink China EV tariff plan
  • Geely is scouting locations for Europe plant amid EU-China tariffs dispute
  • Honda cuts jobs in China, suspends production at three plants
  • Volvo Truck delays construction of battery plant in Sweden
  • New-vehicle prices continue to tumble in August, incentives Uu nearly 50% Y/Y says Cox
  • US House passes bill targeting China that would limit EV tax credits

Industrial

  • China grows its dominance in the global supply of solar panels

Datacenter

  • Dell sees job cuts continuing amid marging pressure from AI servers and weak PC demand

Semiconductors

  • ASML needs licence to service some equipment in China, Dutch government says
  • Intel’s CHIPS Act fund delayed by officials — Washington reportedly wants more information before disbursing billions of dollars
  • TSMC August revenue grows 33% Y/Y
  • GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
  • Vietnam to roll out chip incentive subsidy policy
  • Mobileye to cease LIDAR development
  • NXP to invest more than $1 bln in India as it boosts R&D efforts
  • Samsung Electronics plans global job cuts of up to 30% in some divisions
  • Samsung Electronics withdraws personnel from Taylor fab amid 2nm yield issues
  • Tesla’s Dojo 2 expected to be mass produced by the end of 2025; Dojo 3 slated for 2026

Other

  • Apple announces its next-gen iPhone 16, smartwatch and AirPods; iPhone AI features set to roll out over time
  • Huawei launches tri-foldable phone; touts 4 million pre-orders
  • East Coast and Gulf Coast dockworkers bracing for a strike at major American Ports
  • AI PCs fail to boost 2H24 notebook shipments despite launch
  • European firms more wary of investing in China says lobby group
  • US businesses’ optimism in China falls to record low, survey shows

Related

Source: Edgewater Research

Recent Posts

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

22.4.2026
8

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
21

Wk 16 Electronics Supply Chain Digest

20.4.2026
18

YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

17.4.2026
21

Würth Elektronik Expanded Capacity for Validation and Services in Asia

16.4.2026
16

Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

16.4.2026
26

YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

16.4.2026
68

YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs

15.4.2026
17

ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

13.4.2026
50

Upcoming Events

Apr 27
15:00 - 16:00 CEST

Commercial Space Screening Approach for Agile, High-Reliability Payloads

Apr 29
10:00 - 11:00 CDT

SEPIC Design Done Right

Apr 30
10:00 - 11:00 CDT

Programming Embedded Systems

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version