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    Motor Run Capacitor Safety Classes S0–S3: A Design Guide

    YAGEO Piezoelectric Sensors for Predictive Maintenance

    Wk 44 Electronics Supply Chain Digest

    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

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    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

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    Motor Run Capacitor Safety Classes S0–S3: A Design Guide

    YAGEO Piezoelectric Sensors for Predictive Maintenance

    Wk 44 Electronics Supply Chain Digest

    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

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Wk 37 Electronics Supply Chain Digest

23.9.2024
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 9-13-24.

DATAPOINT OF THE WEEK: Infineon announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.

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Wk 44 Electronics Supply Chain Digest

IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

Wk 43 Electronics Supply Chain Digest

Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.

Headlines:

Auto

  • BYD lifts its 2024 sales target to 4m units from 3.6m prior
  • BMW trims 2024 profit on technical issue, weak China demand; revises shipments target lower
  • BMW, Toyota aim to make hydrogen-powered EVs mainstream with partnerships
  • EU to trim proposed tariffs on Tesla, other EVs from China
  • Italy seeks early review of EU’s 2035 combustion engine ban
  • Panasonic Energy prepares for high-capacity EV battery production
  • European automakers could face billions in fines for missing 2025 emissions target, Renault CEO says
  • VW CEO Blume says European market shrinking amid tougher competition
  • Spanish Prime Minister Sanchez says EU should rethink China EV tariff plan
  • Geely is scouting locations for Europe plant amid EU-China tariffs dispute
  • Honda cuts jobs in China, suspends production at three plants
  • Volvo Truck delays construction of battery plant in Sweden
  • New-vehicle prices continue to tumble in August, incentives Uu nearly 50% Y/Y says Cox
  • US House passes bill targeting China that would limit EV tax credits

Industrial

  • China grows its dominance in the global supply of solar panels

Datacenter

  • Dell sees job cuts continuing amid marging pressure from AI servers and weak PC demand

Semiconductors

  • ASML needs licence to service some equipment in China, Dutch government says
  • Intel’s CHIPS Act fund delayed by officials — Washington reportedly wants more information before disbursing billions of dollars
  • TSMC August revenue grows 33% Y/Y
  • GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
  • Vietnam to roll out chip incentive subsidy policy
  • Mobileye to cease LIDAR development
  • NXP to invest more than $1 bln in India as it boosts R&D efforts
  • Samsung Electronics plans global job cuts of up to 30% in some divisions
  • Samsung Electronics withdraws personnel from Taylor fab amid 2nm yield issues
  • Tesla’s Dojo 2 expected to be mass produced by the end of 2025; Dojo 3 slated for 2026

Other

  • Apple announces its next-gen iPhone 16, smartwatch and AirPods; iPhone AI features set to roll out over time
  • Huawei launches tri-foldable phone; touts 4 million pre-orders
  • East Coast and Gulf Coast dockworkers bracing for a strike at major American Ports
  • AI PCs fail to boost 2H24 notebook shipments despite launch
  • European firms more wary of investing in China says lobby group
  • US businesses’ optimism in China falls to record low, survey shows

Related

Source: Edgewater Research

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