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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

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Wk 37 Electronics Supply Chain Digest

23.9.2024
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 9-13-24.

DATAPOINT OF THE WEEK: Infineon announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.

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Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 33 Electronics Supply Chain Digest

Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.

Headlines:

Auto

  • BYD lifts its 2024 sales target to 4m units from 3.6m prior
  • BMW trims 2024 profit on technical issue, weak China demand; revises shipments target lower
  • BMW, Toyota aim to make hydrogen-powered EVs mainstream with partnerships
  • EU to trim proposed tariffs on Tesla, other EVs from China
  • Italy seeks early review of EU’s 2035 combustion engine ban
  • Panasonic Energy prepares for high-capacity EV battery production
  • European automakers could face billions in fines for missing 2025 emissions target, Renault CEO says
  • VW CEO Blume says European market shrinking amid tougher competition
  • Spanish Prime Minister Sanchez says EU should rethink China EV tariff plan
  • Geely is scouting locations for Europe plant amid EU-China tariffs dispute
  • Honda cuts jobs in China, suspends production at three plants
  • Volvo Truck delays construction of battery plant in Sweden
  • New-vehicle prices continue to tumble in August, incentives Uu nearly 50% Y/Y says Cox
  • US House passes bill targeting China that would limit EV tax credits

Industrial

  • China grows its dominance in the global supply of solar panels

Datacenter

  • Dell sees job cuts continuing amid marging pressure from AI servers and weak PC demand

Semiconductors

  • ASML needs licence to service some equipment in China, Dutch government says
  • Intel’s CHIPS Act fund delayed by officials — Washington reportedly wants more information before disbursing billions of dollars
  • TSMC August revenue grows 33% Y/Y
  • GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
  • Vietnam to roll out chip incentive subsidy policy
  • Mobileye to cease LIDAR development
  • NXP to invest more than $1 bln in India as it boosts R&D efforts
  • Samsung Electronics plans global job cuts of up to 30% in some divisions
  • Samsung Electronics withdraws personnel from Taylor fab amid 2nm yield issues
  • Tesla’s Dojo 2 expected to be mass produced by the end of 2025; Dojo 3 slated for 2026

Other

  • Apple announces its next-gen iPhone 16, smartwatch and AirPods; iPhone AI features set to roll out over time
  • Huawei launches tri-foldable phone; touts 4 million pre-orders
  • East Coast and Gulf Coast dockworkers bracing for a strike at major American Ports
  • AI PCs fail to boost 2H24 notebook shipments despite launch
  • European firms more wary of investing in China says lobby group
  • US businesses’ optimism in China falls to record low, survey shows

Related

Source: Edgewater Research

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