Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

World’s smallest temperature sensor draws power from radio waves

14.1.2016
Reading Time: 2 mins read
A A

source: Eindhoven University news
Researchers at TU/e have developed a very tiny wireless temperature sensor that is powered in a very special way: from the radio waves that are part of the sensor’s wireless network. This means that the sensor needs not even a single wire, nor a battery that would have to be replaced. The arrival of such sensors is an important development on route towards smart buildings, for instance. But the applications are many and various.

The smart buildings of the future will be full of sensors that will respond to the residents’ every need, and will be as sustainable as possible. Like heating and lighting that only switches on when someone is in the room. That’s only possible if these sensors are wireless and need no batteries, otherwise in a large building you would have to change the batteries every day. This is  demonstrated by TU/e researcher Hao Gao who will be awarded his PhD on Monday 7 December for his thesis in which he developed a sensor that measures just 2 square millimeters and weights a mere 1.6 milligrams, equivalent to a grain of sand.

RelatedPosts

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

The current version of the sensor has a range of 2.5 centimeters; the researchers expect to extend this to a meter within a year, and ultimately to 5 meters. The sensor has a specially developed router, with an antenna that sends radio waves to the sensors to power them. Since this energy transfer is accurately targeted at the sensor, the router consumes very little electricity. And the sensors themselves are made such that their energy consumption is extremely low. The sensor also operates beneath a layer of paint, plaster or concrete. As Peter Baltus, TU/e professor of wireless technology, explains, this makes the sensor easy to incorporate in buildings, for instance by ‘painting’ it onto the wall with the latex.

The sensor contains an antenna that captures the energy from the router. The sensor stores that energy and, once there is enough, the sensor switches on, measures the temperature and sends a signal to the router. This signal has a slightly distinctive frequency, depending on the temperature measured. The router can deduce the temperature from this distinctive frequency.

The same technology enables other wireless sensors to be made, for example to measure movement, light and humidity. The application areas are enormous, Baltus says, ranging from payment systems and wireless identification to smart buildings and industrial production systems. They won’t be expensive either: mass production will keep the cost of a sensor down to around 20 cents. The sensor is based on 65-nm CMOS technology.

The project, called PREMISS, has received funding from the STW technology foundation. The title of Hao Gao’s thesis is ‘Fully Integrated Ultra-Low Power mm-Wave Wireless Sensor Design Methods’. The integrated circuits research was done in the Mixed-Signal Microelectronics group and also involved the TU/e groups Electromagnetics and Signal Processing Systems as well as the Center of Wireless Technology.

 

Related

Recent Posts

ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

11.9.2026
7

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
14
Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

9.9.2026
10

SCHURTER THT DIP Switches Support Hardware-Level Configuration

9.9.2026
3
TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

9.9.2026
14
Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

9.9.2026
12
Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

8.9.2026
4
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
20

Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

7.9.2026
4

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved