Telecommunication

Bourns has released four new multilayer chip inductor series – CE0603G, CE0603M, CE1005Q and CE1608Q – aimed at compact RF...

Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC,...

Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, introduced its CVH160808H Series Multilayer Power Chip...

Littelfuse launches first reflow-compatible illuminated tactile switch with SPDT and long travel. The New K5V Series switches combine LED backlighting,...

The paper “High-Performance Component Strategies to Address Thermal and Frequency Challenges in Base Stations” was presented by Che-Wei Hsu, Murata...

Kyocera Corporation is pleased to announce the release of its new Surface Acoustic Wave (SAW) Filter for Global Navigation Satellite...

Würth Elektronik expands its family of common-mode data lines chokes. The new component packages of the WE-CMDC series enable effective...

YAGEO group introduces high-performance diplexers for dual-band Wi-Fi 6E/7 integration offering compact filtering solutions designed for modern wireless applications. YAGEO...

KYOCERA AVX announced advanced Band71 (600 MHz) compact 1814 size SAW duplexer for next-generation smartphones and communication devices. Kyocera Corporation...

Edgewater researchers report that AI momentum continues to support the second half of 2025, while a broader recovery is still...