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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

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    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

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Digi-Key Electronics Announces 2022 Back2School Prize Draw

26.9.2022
Reading Time: 2 mins read
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Digi-Key Electronics has opened its highly-anticipated annual Back2School Prize Draw sweepstakes, which gives college students an opportunity to win prizes that empower them to use real-world engineering tools and resources. Submissions are open by October 28, 2022.

There will be 11 prize giveaways total, and winners will be randomly selected. One grand prize winner will receive a LulzBot Mini 3D printer and filament; five second prize winners will receive the Picade X HAT Arcade Game kit, DK ruler and Innovation Handbook; and five third prize winners will receive a Pokit meter, DK ruler, 50 DK Solderful breadboards, Innovation Handbook, Machinechat license and Molex wire crimper. The content of the prize kits may vary depending on the applicant’s region, but the prizes will be of equivalent value.

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“We’re excited to once again host our popular Back2School Prize Draw, providing students with components to not only apply to their classes but that also help to fuel their innovation,” said YC Wang, global academic program director at Digi-Key. “Digi-Key is proud to offer the tools they need to flex their imaginations and engineering muscles while providing encouragement and support to advance their skills and cultivate their passion for engineering.” 

“Students are the next generation of innovators, and at Digi-Key, we’re dedicated to empowering and supporting them,” said David Sandys, director of technical marketing at Digi-Key. “We want to provide students with valuable tools, products and resources that encourage them to always continue learning and honing their skills to spark new ideas.”

The sweepstakes is open to any student with a university or college email address, and entries may be made in students’ local language. To learn more or enter the Back2School Prize Draw, visit Digi-Key’s website here. Submissions are open from Sept. 12-Oct. 28, 2022, and winners will be announced shortly after the Oct. 28 deadline.

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Source: DigiKey

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