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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

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    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
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    • Derating
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    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

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EPCI Capacitor and Resistor Mounting Guidelines Survey

11.7.2018
Reading Time: 3 mins read
A A

Source: EPCI

Mounting related induced failures are the number one reason (over 55%) for the field application capacitor failure causes. Thus, a careful evaluation of mounting guidelines and follow up in real assembly processes per the component manufacturers’ recommendations shall be considered as a critical characteristic. EPCI is pleased to introduce free online capacitor and resistor mounting guidelines survey based on publicly available information from capacitor and resistor component manufacturers.

RelatedPosts

Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

EPCI is presenting the capacitor mounting guidelines survey under the Chapter M of its ABC of CLR, an on-line free access tutorial handbook that provides technical knowledge about basic principles, types, construction, characteristics, and applications on Capacitors, Inductors and Resistors.

The target of the survey is to collect the manufacturer’s recommendations and good tips for capacitors and resistor mounting BEYOND the industry standards. The survey doesn’t aim to provide a complete overview of mounting procedures as part of specific industrial requirement and standards.

The survey is available in a form of website post Chapter M of ABC of CLR website or in pdf white paper that can be downloaded here.

The EPCI Capacitors and Resistors Mounting Survey was prepared under European Space Agency ESA contract with European Passive Components Institute on passive components support.

 

Content:

  • Industry Mounting and Component Handling Specification Review
  • Mounting Techniques Overview
    • IR reflow soldering
    • Wave Soldering
    • Vapour Phase Soldering
    • Wire Bonding
    • Adhesive Bonding
    • Hand Soldering
    • PCB Embedding

  • Common Soldering Process Issues
    • Oxidisation
    • Component displacement
    • Outgassing
    • Sulphur Contamination
    • General Measures to Enhance Components’ Soldering and Mounting Capabilities

 

  • PCB Board Design and Handling
    • Board Design and Component Pre-Assembly Preparation
    • Component Spacing
    • Component Handling
    • Pick & Place

 

  • Soldering, PCB handling and Rework
    • Flux
    • Preheat
    • Cooling
    • Solder Joint Quality
    • Cleaning
    • Post Solder Handling
    • PCB Coating, Potting and Molding
    • PCB Cut and Cropping
    • PCB Storage
    • Rework
    • Solder Iron Rework
    • Spot Heater Rework
    • Component Storage
    • Re-Life

Capacitor and Resistor Manufacturers Public Sources Included in the survey:

Capacitor Manufacturers:

  • AVX
  • Cobham Microwave
  • Exxelia
  • Kemet
  • Murata
  • Nichicon
  • Nippon Chemicon
  • Taiyo-Yuden
  • TDK
  • Semco
  • Panasonic
  • Vishay
  • Walsin
  • Yageo

Resistor Manufacturers:

  • Ampcontrol
  • Arcol
  • Cressall Resistors
  • HVR Pentagon
  • Isabellenhütte Heusler
  • Japan Resistor Manufacturing
  • KOA Speer
  • Murata
  • Ohmite
  • Panasonic
  • Rohm
  • TE Connectivity
  • Telema Precision Resistor Company
  • Vishay (USA)

 

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