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    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    YMIN Releases Square Supercapacitors for AI Server Power System

    Exxelia Extends Temperature Range of its PP Film Capacitors to 140C

    How Long-Term Storage Causes Aging in Electronic Components

    Nichicon Presents Self-Charging LTO Board for Maintenance-Free IoT Nodes

    Mechanical SSC Testing as a Structural Diagnostic Tool for Tantalum Capacitor Anodes

    Stackpole Introduces High‑Voltage Low VCR Chip Resistors

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EPCI Capacitor and Resistor Mounting Guidelines Survey

11.7.2018
Reading Time: 3 mins read
A A

Source: EPCI

Mounting related induced failures are the number one reason (over 55%) for the field application capacitor failure causes. Thus, a careful evaluation of mounting guidelines and follow up in real assembly processes per the component manufacturers’ recommendations shall be considered as a critical characteristic. EPCI is pleased to introduce free online capacitor and resistor mounting guidelines survey based on publicly available information from capacitor and resistor component manufacturers.

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Exxelia Extends Temperature Range of its PP Film Capacitors to 140C

EPCI is presenting the capacitor mounting guidelines survey under the Chapter M of its ABC of CLR, an on-line free access tutorial handbook that provides technical knowledge about basic principles, types, construction, characteristics, and applications on Capacitors, Inductors and Resistors.

The target of the survey is to collect the manufacturer’s recommendations and good tips for capacitors and resistor mounting BEYOND the industry standards. The survey doesn’t aim to provide a complete overview of mounting procedures as part of specific industrial requirement and standards.

The survey is available in a form of website post Chapter M of ABC of CLR website or in pdf white paper that can be downloaded here.

The EPCI Capacitors and Resistors Mounting Survey was prepared under European Space Agency ESA contract with European Passive Components Institute on passive components support.

 

Content:

  • Industry Mounting and Component Handling Specification Review
  • Mounting Techniques Overview
    • IR reflow soldering
    • Wave Soldering
    • Vapour Phase Soldering
    • Wire Bonding
    • Adhesive Bonding
    • Hand Soldering
    • PCB Embedding

  • Common Soldering Process Issues
    • Oxidisation
    • Component displacement
    • Outgassing
    • Sulphur Contamination
    • General Measures to Enhance Components’ Soldering and Mounting Capabilities

 

  • PCB Board Design and Handling
    • Board Design and Component Pre-Assembly Preparation
    • Component Spacing
    • Component Handling
    • Pick & Place

 

  • Soldering, PCB handling and Rework
    • Flux
    • Preheat
    • Cooling
    • Solder Joint Quality
    • Cleaning
    • Post Solder Handling
    • PCB Coating, Potting and Molding
    • PCB Cut and Cropping
    • PCB Storage
    • Rework
    • Solder Iron Rework
    • Spot Heater Rework
    • Component Storage
    • Re-Life

Capacitor and Resistor Manufacturers Public Sources Included in the survey:

Capacitor Manufacturers:

  • AVX
  • Cobham Microwave
  • Exxelia
  • Kemet
  • Murata
  • Nichicon
  • Nippon Chemicon
  • Taiyo-Yuden
  • TDK
  • Semco
  • Panasonic
  • Vishay
  • Walsin
  • Yageo

Resistor Manufacturers:

  • Ampcontrol
  • Arcol
  • Cressall Resistors
  • HVR Pentagon
  • Isabellenhütte Heusler
  • Japan Resistor Manufacturing
  • KOA Speer
  • Murata
  • Ohmite
  • Panasonic
  • Rohm
  • TE Connectivity
  • Telema Precision Resistor Company
  • Vishay (USA)

 

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