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    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

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    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

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High Density Interconnect PCBs

11.8.2025
Reading Time: 1 min read
A A

This webinar from Würth Elektronik continue series “PCB Production” with High Density Interconnect (HDI) PCBs.

In this video you will learn how the miniaturization technologies MICROVIA.hdi and SLIM.hdi are designed and manufactured and to what extent the wiring density can be increased.

RelatedPosts

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Understanding this helps in PCB design to be able to successfully implement the requirements from the functional specification in the design and the knowledge equally helps in communicating with the PCB manufacturer. This webinar series teaches the basics of PCB production and is aimed at PCB designers, buyers, electronics developers and students.

In this webinar you will learn more about

  • Manufacturing and fabrication processes for HDI printed circuit boards
  • Via design for BGA unbundling and the impact on stackup and manufacturing
  • WE advantageous standard stackups
  • Solder carrier as assembly aid for very thin PCBs
  • Application examples

Related

Source: Würth Elektronik

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