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    DigiKey Presents Factory Tomorrow Season 5 Video Series

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    source: Samtec

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    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

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    DigiKey Presents Factory Tomorrow Season 5 Video Series

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

    Vishay Releases Harsh Environment Robust DC-Link Film Capacitor

    Bourns Releases Automotive High Creepage and Clearance Transformer

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
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    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
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    • Resistors explained
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High Density Interconnect PCBs

11.8.2025
Reading Time: 1 min read
A A

This webinar from Würth Elektronik continue series “PCB Production” with High Density Interconnect (HDI) PCBs.

In this video you will learn how the miniaturization technologies MICROVIA.hdi and SLIM.hdi are designed and manufactured and to what extent the wiring density can be increased.

RelatedPosts

Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

SEPIC Converter with Coupled and Uncoupled Inductors

Würth Elektronik Releases Push-Button and Main Switches

Understanding this helps in PCB design to be able to successfully implement the requirements from the functional specification in the design and the knowledge equally helps in communicating with the PCB manufacturer. This webinar series teaches the basics of PCB production and is aimed at PCB designers, buyers, electronics developers and students.

In this webinar you will learn more about

  • Manufacturing and fabrication processes for HDI printed circuit boards
  • Via design for BGA unbundling and the impact on stackup and manufacturing
  • WE advantageous standard stackups
  • Solder carrier as assembly aid for very thin PCBs
  • Application examples

Related

Source: Würth Elektronik

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