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    Benefits of Tantalum Powder Stress–Strain Curve Evaluation vs Conventional Wet Test

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    Connector PCB Design Challenges

    Researchers Demonstrated High Energy Ceramic Capacitors Stable in Wide Temperature Range

    Stackpole Offers High Voltage Plate Resistors up to 40KV

    How to Manage Supercapacitors Leakage Current and Self Discharge 

    Qualification of Commercial Supercapacitors for Space Applications

    Experimental Evaluation of Wear Failures in SMD Inductors

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High Density Interconnect PCBs

11.8.2025
Reading Time: 1 min read
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This webinar from Würth Elektronik continue series “PCB Production” with High Density Interconnect (HDI) PCBs.

In this video you will learn how the miniaturization technologies MICROVIA.hdi and SLIM.hdi are designed and manufactured and to what extent the wiring density can be increased.

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Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

Understanding this helps in PCB design to be able to successfully implement the requirements from the functional specification in the design and the knowledge equally helps in communicating with the PCB manufacturer. This webinar series teaches the basics of PCB production and is aimed at PCB designers, buyers, electronics developers and students.

In this webinar you will learn more about

  • Manufacturing and fabrication processes for HDI printed circuit boards
  • Via design for BGA unbundling and the impact on stackup and manufacturing
  • WE advantageous standard stackups
  • Solder carrier as assembly aid for very thin PCBs
  • Application examples

Related

Source: Würth Elektronik

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External Visual Inspection per MIL-STD-883 TM 2009

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Space and Military Standards for Hybrids and RF Microwave Modules

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