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    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

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    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

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    Inductor Resonances and its Impact to EMI

    Developing Low Inductance Film Capacitor using Bode 100 Analyzer

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Würth Elektronik Releases High Performance TLVR Coupled Inductors

    YAGEO Extends Rectangular Aluminum Electrolytic Capacitor Family

    Dr. Tomas Zednicek Vision for Europe 2025 Passive Electronics Market

    Littelfuse Releases Industry-First SMD Fuse with 1500A Interrupting Rating at 277V

    TDK Unveils Industry Highest Rated Current Multilayer Chip Beads

    Vishay Releases Automotive SMD Thick Film Power Resistor for Enhanced Protection Against Short Transient Pulses

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    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Coupled Inductors in Multiphase Boost Converters

    VPG Demonstrates Precision Resistor in Cryogenic Conditions

    Comparison Testing of Chip Resistor Technologies Under High Vibration

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High Density Interconnect PCBs

17.12.2024
Reading Time: 1 min read
A A

This webinar from Würth Elektronik continue series “PCB Production” with High Density Interconnect (HDI) PCBs.

In this video you will learn how the miniaturization technologies MICROVIA.hdi and SLIM.hdi are designed and manufactured and to what extent the wiring density can be increased.

RelatedPosts

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Understanding this helps in PCB design to be able to successfully implement the requirements from the functional specification in the design and the knowledge equally helps in communicating with the PCB manufacturer. This webinar series teaches the basics of PCB production and is aimed at PCB designers, buyers, electronics developers and students.

In this webinar you will learn more about

  • Manufacturing and fabrication processes for HDI printed circuit boards
  • Via design for BGA unbundling and the impact on stackup and manufacturing
  • WE advantageous standard stackups
  • Solder carrier as assembly aid for very thin PCBs
  • Application examples

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Source: Würth Elektronik

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