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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

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    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

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    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

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    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

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Laser nano-Soldering Yields High-Conductive Silver nano-Wire Electrodes

20.1.2022
Reading Time: 2 mins read
A A

Researchers at Jinan University and the Chinese Academy of Sciences developed a plasmon-enhanced laser nanosoldering technology to increase the electrical conductivity of silver (Ag) nanowires that are fabricated using femtosecond laser direct writing (FsLDW).

This technology could provide an efficient, cost-effective way to rapidly produce large-area metal nanoelectrodes and capacitors that are uniform, flexible, and highly conductive.

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FsLDW is used to build Ag nanowires for engineered patterns in 2D and 3D, and that have submicron resolution. This nanofabrication method offers many advantages, including high resolution, true three-dimensionality, and flexibility. It is widely used in the fabrication of optoelectronic devices.

There is one challenge to using this method, however; the Ag nanowires built using FsLDW are composed of aggregates of Ag nanoparticles with void or polymer inclusions that reduce electrical conductivity.

To increase conductivity and reduce the resistance of direct-write Ag nanowires, the researchers aimed to reduce the gaps and increase the contact area between the Ag nanoparticles — thereby reducing the amount of energy dissipated by the conductive electrons in the electrode.

(a) Schematic of experimental system for PLNS. (b) Scanning electron microscope (SEM) image of Ag NWs with inset showing the size distribution of Ag NPs in Ag NWs. (c) Plasmon-enhanced electric field as a function of interparticle gap for light polarization direction parallel and vertical to the interparticle axis. (d) Schematic illustration of PLNS with increasing laser irradiation time. (e) SEM images of the morphological changes of Ag NWs in PLNS process. credit: https://www.oejournal.org/article/doi/10.29026/oea.2021.200101

The researchers used the photothermal effect to significantly increase the contact area of adjacent Ag nanoparticles.

Plasmon-enhanced laser nanosoldering — the method used by the researchers to enhance the electrical conductivity of the Ag nanowires — takes advantage of the structural characteristics of the FsLDW-fabricated Ag nanowires.

The nanowires are composed of aggregates of nanoparticles that are reduced by the multiphoton absorption effect. Plasmonic hot spots are generated between the nanoparticles under laser irradiation.

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Source: Opto-Electronic Advances

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