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    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

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    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

    Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

    Panasonic EVP-BX Quiet Tactile Switches for HMI Designs

    Motor Run Capacitor Safety Classes S0–S3: A Design Guide

    YAGEO Piezoelectric Sensors for Predictive Maintenance

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Murata Interview on the 5G Big Bang and How it Will Influence the Market

28.10.2020
Reading Time: 2 mins read
A A

The 5G big bang is coming, this will herald many new applications and pose new challenges to existing devices. In this video from David Kirk – President of Murata Electronics America we explore how 5G will affect industry and how manufacturers will need to prepare.

5G Challenges

The long-awaited 5G rollout is underway. Consumers in more than 20 countries can now access 5G speeds on their smartphones. 
Over the next few years, standardization will pave the way for huge throughput, latency and availability enhancements that promise to unleash the benefits of 5G to many new industries and applications. 

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For organizations to achieve the promised commercial success, however, the 5G ecosystem will have to mitigate component-level risks around many issues, including:

  • Thermal Management
  • Battery Life
  • Low Latency
  • Miniaturisation
  • Scalability

5G Market

High performance components for 5G, from infrastructure, through handsets to miniaturized IoT devices will be needed for development of critical hardware in the fields like:

  • Enhanced mobile broadband (eMBB) delivering much faster, low-latency and massive machine type communications (mMTC) to optimise user experience and herald many applications.
  • Massive IoT for applications that are less latency sensitive and have relatively low throughput requirements, but require a huge volume of low-cost, low-energy consumption devices on a network with excellent coverage.
  • Ensuring secure communications to first responders, governments and industries. From dedicated networks to commercial mobile networks with specialist embedded mission-critical capabilities.
  • Private network with unified connectivity, secure means of communication within a specific area. It will deliver the speed, latency and other benefits promised by 5G to support next-generation applications.

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Source: Murata

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