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    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

    YAGEO Unveils Multilayer Piezoelectric Actuators

    Bourns CSI2F bolt-down current sense resistors for high-current busbar measurement

    Bourns Current Sense Resistors Reach 36 W

    Wk 38 Electronics Supply Chain Digest

    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

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    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

    YAGEO Unveils Multilayer Piezoelectric Actuators

    Bourns CSI2F bolt-down current sense resistors for high-current busbar measurement

    Bourns Current Sense Resistors Reach 36 W

    Wk 38 Electronics Supply Chain Digest

    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Trending Tags

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    • Tantalum vs Ceramic
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Murata Interview on the 5G Big Bang and How it Will Influence the Market

28.10.2020
Reading Time: 2 mins read
A A

The 5G big bang is coming, this will herald many new applications and pose new challenges to existing devices. In this video from David Kirk – President of Murata Electronics America we explore how 5G will affect industry and how manufacturers will need to prepare.

5G Challenges

The long-awaited 5G rollout is underway. Consumers in more than 20 countries can now access 5G speeds on their smartphones. 
Over the next few years, standardization will pave the way for huge throughput, latency and availability enhancements that promise to unleash the benefits of 5G to many new industries and applications. 

RelatedPosts

Ruggedized Passive Components: Reliability Beyond the Datasheet

YAGEO Unveils Multilayer Piezoelectric Actuators

Bourns Current Sense Resistors Reach 36 W

For organizations to achieve the promised commercial success, however, the 5G ecosystem will have to mitigate component-level risks around many issues, including:

  • Thermal Management
  • Battery Life
  • Low Latency
  • Miniaturisation
  • Scalability

5G Market

High performance components for 5G, from infrastructure, through handsets to miniaturized IoT devices will be needed for development of critical hardware in the fields like:

  • Enhanced mobile broadband (eMBB) delivering much faster, low-latency and massive machine type communications (mMTC) to optimise user experience and herald many applications.
  • Massive IoT for applications that are less latency sensitive and have relatively low throughput requirements, but require a huge volume of low-cost, low-energy consumption devices on a network with excellent coverage.
  • Ensuring secure communications to first responders, governments and industries. From dedicated networks to commercial mobile networks with specialist embedded mission-critical capabilities.
  • Private network with unified connectivity, secure means of communication within a specific area. It will deliver the speed, latency and other benefits promised by 5G to support next-generation applications.

Related

Source: Murata

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