Vishay Intertechnology, Inc. introduced a new series of AEC-Q200 qualified, high power thin film wraparound chip resistors. The Vishay Dale ...

The range of MagI³C-FDSM power modules with 36 V input voltage has been expanded to include a version with 12 ...

New superconducting magnet breaks magnetic field strength records, paving the way for practical, commercial, carbon-free power. It was a moment ...

TDK Corporation has expanded its CN series of multilayer ceramic capacitors (MLCCs) that are the first of their kind. The ...

On July 2013, a new version of USB specification was released and officially published in August 2014: USB 3.1 or ...

USB 3.0 targets first the PC market and all consumer devices requiring high data rate and volumes of data transfer ...

Now, let’s move on to the connector aspect in order to understand what this implies. Designing a brand new high-speed ...

Many other communication standards provide equivalent or even higher data rate than USB 3.0, namely: PCIe gen 2.0 (5 Gbits/s), ...

Architecture: from High-Speed to Super-SpeedUSB 3.0 consists of a physical super-speed bus in addition to the physical USB 2.0 bus ...

The new USB 3.0 standard, also known as USB Super Speed, brings about an impressive ten time increase in bandwidth, ...