Page 320 – Passive Components Blog

Figure 1: Inductor Using Ferrite and Iron Powder Technology; source: Chillisin

Space on a PCB is in short supply, but the demands placed on the technical properties of inductive components continue ...

‘Perfect Storm’ Creates Electronic Component Supply Chain Shortages

2.6.2021

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We’re in the midst of what could be called a “perfect storm” that is creating significant supply chain shortages for ...

3rd PCNS Registration is Now OPEN !

11.10.2021

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3rd PCNS Passive Components Networking Symposium is now open for on-line registration. The third PCNS is organized as a hybrid ...

The new interposer design with an embedded capacitor provides a notable reduction in area requirements and interconnect length, leading to lower wiring resistance and parasitic capacitance. MPU: Microprocessing unit; DRAM: Direct random-access memory. Credit: The 2021 IEEE Electronic Components and Technology Conference

Embedding Capacitors into Interposers

2.6.2021

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Scientists at Tokyo Institute of Technology develop a 3D functional interposer -the interface between a chip and the package substrate--containing ...

Demand from 5G Handsets, BEVs is Increasing Lead Times for Passives

2.6.2021

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Lead times are increasing for multiple types of passive electronic components in 2021. Dennis M. Zogbi comment the latest trend ...

Supply chain: Yageo raises the price of passive components

2.6.2021

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According to supply chain, Yageo has recently notified customers that its chip resistors and tantalum capacitors will increase in price ...

SMP Releases Compact, Low-Noise, Low-Loss Chokes for Medical Applications

2.6.2021

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SMP Sintermetalle Prometheus GmbH & Co KG (SMP), German manufacturer of soft-magnetic materials and inductive components, offers chokes for medical ...