Page 367 – Passive Components Blog

by Ciprian Ionescu, Andrei Drumea, Paul Svasta, Alexandru Vasile, Norocel CodreanuUniversity “Politehnica” of Bucharest, Romania, Center of Technological Electronics and ...

Bourns Introduces its Smallest Miniature Resettable Thermal Cutoff Devices

9.11.2019

10

Source: Bourns news RIVERSIDE, Calif., Bourns, Inc., a leading manufacturer and supplier of electronic components, today introduced the company's smallest ...

Ceramic Capacitors market worldwide is projected to grow by US$3.6 Billion according to Global Industry Analysts

18.10.2019

3

Source: ReportLinker news Ceramic Capacitors market worldwide is projected to grow by US$3.6 Billion, driven by a compounded growth of ...

H.C. Starck launches tantalum and niobium metal powder range for additive manufacturing

9.11.2019

47

Source: 3D Printing Industry article H.C. Starck Tantalum and Niobium, a metal powder manufacturer based in Germany, has announced the ...

Ohmcraft Designs Custom Resistors for NASA’s 2020 Mission to Jupiter

17.10.2019

2

Source: Ohmcraft; EIN Presswire news ROCHESTER, N.Y., UNITED STATES, -- The prospect of life beyond Earth has fascinated scientists for decades. ...

Vishay Introduces Three New Automotive Grade IHLP® Inductors in Its Smallest 1212 Case Size

17.10.2019

2

Source: Vishay news Vishay intertechnology introduces three new automotive grade IHLP® inductors in its smallest 1212 case size for under ...

TDK releases new compact film capacitors for DC link applications

15.10.2019

6

Source: TDK news TDK Corporation has extended the portfolio of EPCOS film capacitors for DC link applications with the B3277*X/Y/Z ...

How to determine and measure MLCC ripple current and ESR

5.12.2019

241

Source: Kemet Application Intelligence Center video Kemet Application Intelligence Center released a video with practical example of how MLCC ceramic ...