Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers optimize additive manufacturing on a molecular level

18.12.2019
Reading Time: 3 mins read
A A

UNIVERSITY PARK, Pa. — As the complexity and applications of additive manufacturing increase, Penn State researchers are digging down to the smallest scales to optimize the technology on a molecular level. 

“There are still a lot of unknowns about how 3D printing actually works,” said Adri van Duin, principal investigator of the project and professor of mechanical engineering, chemical engineering, and engineering science and mechanics at Penn State. “For this project, we theorized you could learn a lot by looking at the various molecules they’re operating with.” 

RelatedPosts

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

Samtec Expands Offering of Slim, High-Density HD Array Connectors

featured image: In a simulation, chromium-oxide nanoparticles create bonds with a water-based diethylene glycol solution. IMAGE: Adri van Duin Penn State University

A paper published in the Physical Chemistry Chemical Physics Journal details how researchers examined additive manufacturing methods and materials using atomistic-scale simulations to optimize their performance for ultimately stronger and more useful 3D-printed components. 

“We went down to the most fundamental level, looking at the physical chemistry and the strengths of these molecular interactions,” van Duin said.

Specifically, his team scrutinized the reactions occurring within a binder jetting solution used for 3D printing, which essentially acts as the glue that bonds the printed layers of primary materials together.

“You want the glue to organize itself in the space between the nanoparticles,” van Duin said. “It’s also ideal if the molecules still have the ability to move.”

For the purposes of this study, van Duin and his team created a computational framework using ReaxFF, a program for modeling atomistic chemical reactions, to study chromium-oxide nanoparticles, a metal commonly used in additive manufacturing, and binders containing water-based diethylene glycol solutions that form strong connections through a hydrogen bond network. 

“The design focus is modifying these components and examining the impacts of temperature phases to get the optimal binding strength, while also allowing the molecules to move on the surface together,” van Duin said.

After these molecules are successfully bound together, the high temperatures within a 3D printer needed for curing and sintering essentially boil away the now-unnecessary organic molecules, while keeping the metal oxides merged in the finished piece. According to the computational framework designed for the experiment, if these temperatures are too high, it can instead burn out these crucial bonds and result in a decomposition of the final piece. 

However, van Duin and the team of researchers found that by tweaking the amounts of diethylene glycol and water present in the binder solution, they could intensify the occurrence of strong hydrogen bonds, which allowed the mixed material to withstand and thrive under higher temperatures. 

While the results of this experiment have predicted the ability to enhance the creation of 3D-printed parts using chromium-oxide particles, the real strength of this research lies in the computational models. With the creation of this framework, these experiments can be deployed to find the optimal binder chemistry, curing and sintering conditions for any potential materials that can be used in additive manufacturing. 

“Once you understand how strong bindings can be formed, we can apply it to anything we want,” van Duin said. “If we want to try this with peptides, we can simulate that.”

The computations are inexpensive and completed in a relatively short amount of time, which allows researchers to investigate and model new organic molecules to see which methods and materials are most promising for additive manufacturing applications.

Providing further understanding of how molecules can be modified and enhanced before they ever enter in a 3D printer is an area where the researchers see great promise.

“By understanding the process on a nanoscale, we don’t have to redesign a printer,” van Duin said. “But you can greatly accelerate the optimization of the manufacturing.”

Related

Source: Penn State News

Recent Posts

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
32

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
44
a Schematic diagram of the BNT-based components constructed based on the entropy-increase strategy. b Digital photograph, cross-sectional SEM image, and EDS mappings of the MLCCs. c Unipolar P-E loops of MLCCs as a function of applied E. d Wrec and η of the MLCCs as a function of applied E. The comparison of (e) Wrec and η, (f) η and UF of the MLCCs with those of other recently reported state-of-the-art MLCCs. source: Nature Communications

Researchers Proposed Enhanced Energy Storage MLCC

1.10.2025
26

Development of Nitrogen-Doped Graphene Supercapacitors 

30.9.2025
19

Researchers Developed Reduced Graphene Oxide (rGO) High Energy Density Graphene Supercapacitors

18.9.2025
41

Researchers Enhanced 2D Ferromagnets Performance

16.9.2025
9

Researchers Demonstrated HfO Anti-Ferroelectric Flexible Capacitors

19.8.2025
21

Additive Manufacturing of Mn-Zn Ferrite Planar Inductors

4.8.2025
46

Researchers Presents High-Performance Carbon-Based Supercapacitors

1.8.2025
45

Researchers Demonstrated 200C Polymer Film Dielectric

28.7.2025
25

Upcoming Events

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version