Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    PCNS 2025 Final Program Announced!

    DigiKey Expands Inventory with Over 32,000 Stocking NPIs in Q2 2025

    YAGEO Offers High-Performance Diplexers for Dual-Band Wi-Fi 6E/7Integration

    European Components Distribution (DMASS) Faces Continued Decline in Q2 2025

    TDK Announced Wide Frequency Automotive Wirewound POC Inductors

    Bourns Released Rugged, High-Power TO-247 Thick Film Resistor

    Bourns Announced Shielded Power Inductor with High Saturation and Low Radiation

    Würth Elektronik Expands MagI³C with Variable Step-Down Modules

    KYOCERA AVX Releases 600MHz Band71 Compact SAW Duplexer

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

    Understanding Switched Capacitor Converters

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    PCNS 2025 Final Program Announced!

    DigiKey Expands Inventory with Over 32,000 Stocking NPIs in Q2 2025

    YAGEO Offers High-Performance Diplexers for Dual-Band Wi-Fi 6E/7Integration

    European Components Distribution (DMASS) Faces Continued Decline in Q2 2025

    TDK Announced Wide Frequency Automotive Wirewound POC Inductors

    Bourns Released Rugged, High-Power TO-247 Thick Film Resistor

    Bourns Announced Shielded Power Inductor with High Saturation and Low Radiation

    Würth Elektronik Expands MagI³C with Variable Step-Down Modules

    KYOCERA AVX Releases 600MHz Band71 Compact SAW Duplexer

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

    Understanding Switched Capacitor Converters

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Sintering may create new electronics manufacturing technologies

7.12.2015
Reading Time: 2 mins read
A A

source: Energy Harvesting Journal article

Engineers at Oregon State University have made a fundamental breakthrough in understanding the physics of photonic “sintering,” which could lead to many new advances in solar cells, flexible electronics, various types of sensors and other high-tech products printed onto something as simple as a sheet of paper or plastic.

RelatedPosts

PCNS 2025 Final Program Announced!

DigiKey Expands Inventory with Over 32,000 Stocking NPIs in Q2 2025

YAGEO Offers High-Performance Diplexers for Dual-Band Wi-Fi 6E/7Integration


Sintering is the fusing of nanoparticles to form a solid, functional thin-film that can be used for many purposes, and the process could have considerable value for new technologies.

Photonic sintering has the possible advantage of higher speed and lower cost, compared to other technologies for nanoparticle sintering.

In the new research, OSU experts discovered that previous approaches to understand and control photonic sintering had been based on a flawed view of the basic physics involved, which had led to a gross overestimation of product quality and process efficiency.

Based on the new perspective of this process, which has been outlined in Nature Scientific Reports, researchers now believe they can create high quality products at much lower temperatures, at least twice as fast and with 10 times more energy efficiency.

Removing constraints on production temperatures, speed and cost, the researchers say, should allow the creation of many new high-tech products printed onto substrates as cheap as paper or plastic wrap.

“Photonic sintering is one way to deposit nanoparticles in a controlled way and then join them together, and it’s been of significant interest,” said Rajiv Malhotra, an assistant professor of mechanical engineering in the OSU College of Engineering. “Until now, however, we didn’t really understand the underlying physics of what was going on. It was thought, for instance, that temperature change and the degree of fusion weren’t related – but in fact that matters a lot.”

With the concepts outlined in the new study, the door is open to precise control of temperature with smaller nanoparticle sizes. This allows increased speed of the process and high quality production at temperatures at least two times lower than before. An inherent “self-damping” effect was identified that has a major impact on obtaining the desired quality of the finished film.

“Lower temperature is a real key,” Malhotra said. “To lower costs, we want to print these nanotech products on things like paper and plastic, which would burn or melt at higher temperatures. We now know that is possible, and how to do it. We should be able to create production processes that are both fast and cheap, without a loss of quality.”

Products that could evolve from the research, Malhotra said, include solar cells, gas sensors, radiofrequency identification tags, and a wide range of flexible electronics. Wearable biomedical sensors could emerge, along with new sensing devices for environmental applications.

In this technology, light from a xenon lamp can be broadcast over comparatively large areas to fuse nanoparticles into functional thin films, much faster than with conventional thermal methods. It should be possible to scale up the process to large manufacturing levels for industrial use.

This advance was made possible by a four-year, $1.5 million National Science Foundation Scalable Nanomanufacturing Grant, which focuses on transcending the scientific barriers to industry-level production of nanomaterials. Collaborators at OSU include Chih-hung Chang, Alan Wang and Greg Herman.

OSU researchers will work with two manufacturers in private industry to create a proof-of-concept facility in the laboratory, as the next step in bringing this technology toward commercial production.

Source and top image: Oregon State University

Related

Recent Posts

Researchers Demonstrated 200C Polymer Film Dielectric

28.7.2025
10

Researchers Demonstrated Zinc-Ion Based Photo-Supercapacitor

28.7.2025
9
Comparative display of a grain size and domain structure; b free energy; c P-E loops after high-entropy ceramics (HECs) and PGS design. source: Nature Communications  ISSN 2041-1723

Researchers Propose Novel MLCC Dielectric Design to Increase Energy Storage Capacity

24.7.2025
38

H2-Assisted Thermal Treatment of Electrode Materials Increases Supercapacitors Energy Density

13.5.2025
14

Researchers Present Hybrid Supercapacitor Zn-Ion Microcapacitors

12.5.2025
59

Murata and NIMS Built New Database of Dielectric Material Properties

5.5.2025
120

3D Printing of Passive Components from Manufacturer Perspective

26.4.2025
54

Hybrid Electrochemical Electrolytic Capacitor Provides High Frequency and High Capacitance Performance

25.4.2025
78

Supercapacitor Separator with High Ionic Conductivity Enables Line-Filter Applications at High Power

21.3.2025
59

Interlacing Strain Engineering Boost Energy Density of MLCCs

12.2.2025
89

Upcoming Events

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version