Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    VINATech Targets AI Data Center Supercapacitor Boom

    Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

    TDK Introduces 350V Safety Film Capacitors for Compact EMI Suppression

    Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test

    Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

    Würth Elektronik Present in IEEE APEC

    Samsung Three Pillars MLCC Strategy for AI Hardware Topology

    Bourns Releases High Clearance Transformer for Isolated DC/DC Supplies

    KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    VINATech Targets AI Data Center Supercapacitor Boom

    Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

    TDK Introduces 350V Safety Film Capacitors for Compact EMI Suppression

    Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test

    Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

    Würth Elektronik Present in IEEE APEC

    Samsung Three Pillars MLCC Strategy for AI Hardware Topology

    Bourns Releases High Clearance Transformer for Isolated DC/DC Supplies

    KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TDK Introduces Combined ESD and EMI Voltage Protection Devices for Audio Equipment

9.10.2019
Reading Time: 2 mins read
A A

Source: TDK news

TDK Corporation has expanded its lineup of chip varistors with the new AVRF101U6R8KT242 for audio equipment, which offers both ESD and EMI protection.

RelatedPosts

VINATech Targets AI Data Center Supercapacitor Boom

Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

TDK Introduces 350V Safety Film Capacitors for Compact EMI Suppression

This product is intended for audio equipment that uses wireless communications in the 2.4 GHz band. Thanks to optimization of its capacitance of 6.8 pF, the multilayer component features high attenuation at this frequency and is able to effectively suppress the generated TDMA noise and thus improve receiver sensitivity. It offers excellent ESD protection according to IEC61000-4-2, Level 4 and has a maximum permissible circuit voltage of 28 V DC, making it suitable for high power class-D amplifiers. Key applications include smartphones, speakers and other wireless devices that operate in the 2.4-GHz band using wireless LAN and Bluetooth, for example.

Moving forward, TDK will continue to expand the product lineup in terms of chip sizes, bandwidth support range, and other specifications, in order to support a wide range of applications.

Main Applications

  • ESD and EMI protection of audio equipment such as smartphones, speakers and other wireless devices that operate in the 2.4-GHz band using wireless LAN and Bluetooth

Main Features and Benefits

  • Combined ESD and EMI protection
  • Excellent ESD protection capability according to IEC61000-4-2, level 4
  • Suppression of TDMA noise generated by wireless communications
  • Improved receiver sensitivity for wireless communications
  • High permissible circuit voltage of 28 V DC for high power audio output

Key data

Type Dimensions
[mm]
Max. permissible
circuit voltage
[V]
Capacitance
[pF]
Max. 2.4-GHz
insertion loss
[dB]
AVRF101U6R8KT242 1.0 x 0.5 x 0.5
(EIA0402inch)
28 6.8 pF ±10% -20 max.

Glossary

  • TDMA noise: Unpleasant audible noise generated by speakers when high frequency communication signals intrude into a microphone line
  • IEC61000-4-2: International Electrotechnical Commission’s immunity standard on ESD

Related

Recent Posts

Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

26.2.2026
9

KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

24.2.2026
23

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

20.2.2026
17

Murata Releases World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate

10.12.2025
117

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

31.10.2025
54

Littelfuse Releases First Reflow-Compatible Illuminated Tactile Switch

1.10.2025
19

Components Thermal and Frequency Challenges in 6G Base Stations

30.9.2025
86

Kyocera Launches New SAW Filter for GNSS 1.6GHz Satellite Communications

30.9.2025
57

Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

3.9.2025
73

Upcoming Events

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version