Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Binder Hybrid Connector Simplifies One Cable Automation

    Tapped Inductor Buck Converter Fundamentals

    TAIYO YUDEN Releases Mini Metal Power Inductors

    Molecular Memristor Shows Record 145 kH Emergent Inductance

    Planar vs Conventional Transformer: When it Make Sense

    Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

    Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA

    Wk 19 Electronics Supply Chain Digest

    Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Binder Hybrid Connector Simplifies One Cable Automation

    Tapped Inductor Buck Converter Fundamentals

    TAIYO YUDEN Releases Mini Metal Power Inductors

    Molecular Memristor Shows Record 145 kH Emergent Inductance

    Planar vs Conventional Transformer: When it Make Sense

    Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

    Nichicon ADN Automotive Hybrid Aluminum Capacitors Now Available in EMEA

    Wk 19 Electronics Supply Chain Digest

    Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TDK Introduces Combined ESD and EMI Voltage Protection Devices for Audio Equipment

9.10.2019
Reading Time: 2 mins read
A A

Source: TDK news

TDK Corporation has expanded its lineup of chip varistors with the new AVRF101U6R8KT242 for audio equipment, which offers both ESD and EMI protection.

RelatedPosts

Binder Hybrid Connector Simplifies One Cable Automation

Tapped Inductor Buck Converter Fundamentals

TAIYO YUDEN Releases Mini Metal Power Inductors

This product is intended for audio equipment that uses wireless communications in the 2.4 GHz band. Thanks to optimization of its capacitance of 6.8 pF, the multilayer component features high attenuation at this frequency and is able to effectively suppress the generated TDMA noise and thus improve receiver sensitivity. It offers excellent ESD protection according to IEC61000-4-2, Level 4 and has a maximum permissible circuit voltage of 28 V DC, making it suitable for high power class-D amplifiers. Key applications include smartphones, speakers and other wireless devices that operate in the 2.4-GHz band using wireless LAN and Bluetooth, for example.

Moving forward, TDK will continue to expand the product lineup in terms of chip sizes, bandwidth support range, and other specifications, in order to support a wide range of applications.

Main Applications

  • ESD and EMI protection of audio equipment such as smartphones, speakers and other wireless devices that operate in the 2.4-GHz band using wireless LAN and Bluetooth

Main Features and Benefits

  • Combined ESD and EMI protection
  • Excellent ESD protection capability according to IEC61000-4-2, level 4
  • Suppression of TDMA noise generated by wireless communications
  • Improved receiver sensitivity for wireless communications
  • High permissible circuit voltage of 28 V DC for high power audio output

Key data

Type Dimensions
[mm]
Max. permissible
circuit voltage
[V]
Capacitance
[pF]
Max. 2.4-GHz
insertion loss
[dB]
AVRF101U6R8KT242 1.0 x 0.5 x 0.5
(EIA0402inch)
28 6.8 pF ±10% -20 max.

Glossary

  • TDMA noise: Unpleasant audible noise generated by speakers when high frequency communication signals intrude into a microphone line
  • IEC61000-4-2: International Electrotechnical Commission’s immunity standard on ESD

Related

Recent Posts

Exxelia Miniaturized 400 MHz Inverted‑F Antenna

24.3.2026
21

Bourns Extends PPTC Resettable High‑Power, High‑Voltage Protection Fuses

2.3.2026
25

Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

26.2.2026
22

KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

24.2.2026
63

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

20.2.2026
28

Murata Releases World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate

10.12.2025
128

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

31.10.2025
56

Littelfuse Releases First Reflow-Compatible Illuminated Tactile Switch

1.10.2025
21

Components Thermal and Frequency Challenges in 6G Base Stations

30.9.2025
101

Upcoming Events

May 19
16:00 - 17:00 CEST

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

Jun 2
16:00 - 17:00 CEST

Calculation, Simulation and Measurement of 800V EMC Filters

Jun 16
16:00 - 17:00 CEST

EMC with EMC – EMC‑compliant design with electromechanical connectors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version