Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces C0G Flexible Termination Automotive MLCCs

    SCHURTER Releases SMT Micro Switch for Compact HMIs

    binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

    Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

    Murata Introduces Crystal and NTC Set for Automotive UWB Timing

    Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

    Modeling Fringing Field Losses in Inductors & Transformers

    YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

    Littelfuse Expands High-Voltage TVS Diodes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces C0G Flexible Termination Automotive MLCCs

    SCHURTER Releases SMT Micro Switch for Compact HMIs

    binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

    Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

    Murata Introduces Crystal and NTC Set for Automotive UWB Timing

    Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

    Modeling Fringing Field Losses in Inductors & Transformers

    YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

    Littelfuse Expands High-Voltage TVS Diodes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Würth Elektronik Expands GaN Ready High Current Flat Wire Coil Inductors

19.7.2021
Reading Time: 1 min read
A A

With WE-HCFT 2504, Würth Elektronik has added a model with an unusually low overall height to its tried and tested family of THT high-current inductors.

The flat wire coil with MnZn core is only 4 mm high. With no standard competitors in the market. Current-carrying capability extends to 33 A. Achieving one of the highest power density and efficiency within HCFT family. The inductor also features very low DC and AC losses through its optimized wire and core design. In addition WE-HCFT 2504 exhibits excellent temperature performance over the entire operating temperature range of -40C to +125 °C.

RelatedPosts

Heatsink Design and Thermal Interface Materials for Reliable Electronics

Würth Elektronik Expanded Capacity for Validation and Services in Asia

Würth Elektronik Releases Heat Sinks for TO and IC packages

WE-HCFT 2504 is available in inductance values of 1 µH, 2.2 µH, 4.7 µH, 6.8 µH and 10 µH. The device is suitable for use in POL regulators for FPGA/ASIC/GPU, high-efficiency DC/DC converters, high-current switching power supplies, forward converters, half-bridge and full-bridge converters, as well as battery chargers and solar inverters. The product complies with the AEC-Q200 standard.

Successful example application of the WE-HCFT 2504: the EPC9148 development board, a 48 V three-stage synchronous buck converter with GaN technology.

WE-HCFT 2504 is available immediately from stock with no minimum order quantity. Upon request, Würth Elektronik will provide free samples to developers.

Related

Source: Würth Elektronik

Recent Posts

YAGEO Introduces C0G Flexible Termination Automotive MLCCs

30.4.2026
5

SCHURTER Releases SMT Micro Switch for Compact HMIs

30.4.2026
4

binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

30.4.2026
3

Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

30.4.2026
8

Murata Introduces Crystal and NTC Set for Automotive UWB Timing

30.4.2026
7

Modeling Fringing Field Losses in Inductors & Transformers

30.4.2026
11

Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

27.4.2026
47

Exxelia Introduces SMD High‑Voltage Mica Capacitors

28.4.2026
20

Modelithics Releases COMPLETE v26.1 for Keysight ADS

23.4.2026
13

Upcoming Events

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

May 7
17:00 - 18:00 CEST

From Grid to Motion: How Industrial Electrification is Redefining Power System Design

May 12
8:00 - 15:00 CEST

ESCC Space Splice connectors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version