Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Release Automotive 4-Terminal Shunt Resistors

    Bourns Releases High Inductance Common Mode Choke

    Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

    High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

    Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

    Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

    YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

    Over-Voltage Protection Clippers, Clampers, Snubbers, DC Restorers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Release Automotive 4-Terminal Shunt Resistors

    Bourns Releases High Inductance Common Mode Choke

    Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

    High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

    Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

    KYOCERA AVX Expands Stacked MLCC Capacitors Offering

    Murata and QuantumScape Joint Development for Solid Batteries Ceramic Separators

    YAGEO Unveils Compact 3.6kW LLC Transformer for OBC EV Charging

    Over-Voltage Protection Clippers, Clampers, Snubbers, DC Restorers

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Würth Elektronik’s CTO Alexander Gerfer stressed the importance of an innovative hardware partnership for the success of digital companies

25.9.2019
Reading Time: 2 mins read
A A

Source: Würth Elektronik news

Waldenburg (Germany), 25 September 2019 – Alexander Gerfer, CTO of the Würth Elektronik eiSos Group, at one of the most important digital future conferences worldwide, the DLD Tel Aviv, emphasized in his opening speech “when technology meets customer” design support of hardware and the availability of components can decide on the failure or success of innovation.

RelatedPosts

Bourns Release Automotive 4-Terminal Shunt Resistors

Bourns Releases High Inductance Common Mode Choke

Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

In his speech, Gerfer stressed the importance of an innovative hardware partner for the success of digital companies:

“Würth Elektronik is not just a hardware supplier, we rather see ourselves as our customers’ real partner.”

We know them and their needs thoroughly and focus our product development on them. ‘Can’t’ is not part of our vocabulary. If there is still no solution to a particular challenge, then we’ll invent one. This is the reason why Würth Elektronik, as an innovative technology company, is behind many successes, albeit invisibly … the ‘secret ingredient of industry’ as it were. There are plenty of examples of customer-driven innovations from Würth Elektronik, including REDEXPERT, an online platform developed in-house that has become known worldwide as the most precise option for AC loss calculation in switch mode power supplies.

Another area to improve the CO2 footprint is ‘Horticulture Farming’. Through its cooperation with the Technical University of Munich, Würth Elektronik supports users with practice-relevant data for the selection of the best Horticulture LEDs, adapted to the respective plant species. But that’s not all: There’s another promising project already in the pipeline from the company. “We can’t say too much here yet,” says Gerfer, “only that it’s about the development of very specific components for intelligent clothing of the future.”

Panel discussion with participants from renowned companies

Following his opening speech, Alexander Gerfer participated in the panel discussion moderated by Raz Bachar, Managing Director of Microsoft For Startups. Leaders of prestigious companies, such as Deutsche Telekom, Sage and Panorama Software, discussed the question of how companies can ensure they develop the right technologies for the future. Here, Gerfer convincingly explained why software and digital companies need strong partners to provide them with hardware solutions completely tailored to their needs: “Many start-up companies have the right ideas, but cannot realize them because the hardware needed for prototypes, for example, is not available in small quantities. This is where Würth Elektronik comes into play as a technology enabler. Not only do we supply young companies and developers with the required components, but we also support them with our comprehensive expertise.”

About DLD as a worldwide network for digitization

DLD’s aim is to create a global conference network on digitization covering the fields of business, society, education and culture. Today it is one of the most important innovation conferences in the world. Since its inception in 2005, outstanding speakers such as Mark Zuckerberg, Eric Schmidt and Paolo Coelho have spoken at the conferences in Munich, New York, Beijing, London, Moscow, Hong Kong, Tel Aviv and Singapore.

featured image source: Würth Elektronik

Related

Recent Posts

KYOCERA AVX Expands Stacked MLCC Capacitors Offering

14.10.2025
27

KYOCERA Releases Shielded Board-to-Board Connectors for Reliable EMI Protection

13.10.2025
24

Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

8.10.2025
15

Paumanok Releases Capacitor Foils Market Report 2025-2030

7.10.2025
28

Kyocera Launches New SAW Filter for GNSS 1.6GHz Satellite Communications

30.9.2025
22

Advancements in Flexible End Terminations for Robust MLCCs in EV

26.9.2025
45

Passive Components J-STD-075 Process Sensitivity Level Classification And Labeling

25.9.2025
69

AI Hardware Development and Its Consequences for Passive Electronic Components

23.9.2025
83

Samtec Agreed with Molex Second-Source License on High-Speed Interconnects for Data Centers

18.9.2025
22

August 2025 ECIA US Components Sales Sentiment Remains Strong

18.9.2025
42

Upcoming Events

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version