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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
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Bourns Add New AEC-Q200 SMD Fuse Families to its SinglFuse Product Line

11.2.2020
Reading Time: 2 mins read
A A

Bourns is pleased to announce the introduction of two new series of AEC-Q200 compliant SMD fuses to complement its already successful line of SinglFuseTM SMD Fuse products.

The new Model SF-0603HIA-M and SF-1206HIA-M series utilize Bourns’ popular multilayer ceramic design for enhanced voltage and current handling capabilities in small 0603 and 1206 package sizes. Both families are fully compliant with Bourns’ internal AEC-Q200 equivalent test procedures to ensure performance robustness in certain harsh environments including industrial, medical* (low to medium risk), telecom and Battery Management Systems applications, among others.

RelatedPosts

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

SCHURTER THT DIP Switches Support Hardware-Level Configuration

Features

  • High-inrush current withstand capability n Time lag fusing speed
  • EIA 0603 & 1206 footprints
  • AEC-Q200 compliant****
  • UL 248-14 listed
  • RoHS compliant** and halogen free***

Applications

  • Industrial
  • Medical (low to medium risk)* n Telecom
  • Battery management systems

* Bourns® products have not been designed for and are not intended for use in “lifesaving,” “life-critical” or “life-sustaining” applications nor any other applications where failure or malfunction of the Bourns® product may result in personal injury or death. See Legal Disclaimer Notice http://www.bourns.com/docs/legal/disclaimer.pdf. ** RoHS Directive 2015/863, Mar 31, 2015 and Annex.
*** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. **** Meets Bourns internal AEC-Q200 equivalent test plan.

Related

Source: Bourns

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