Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK HVC28 and HVC29 high-voltage DC contactors with black housings and main power terminals

    TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

    Murata SWL RF coaxial switch connector measurement diagram and SWL-to-SWJ board-area comparison.

    Murata RF Switch Connectors Cut PCB Test-Point Area

    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Breakthrough Achieved In Ceramics 3D Printing Technology

6.1.2016
Reading Time: 1 min read
A A

source: HRL laboratories news

Mon, 01/04/2016 – 9:54am by HRL Laboratories

RelatedPosts

TDK Introduces Gas-Filled High-Voltage DC Contactors up to 600 A

Murata RF Switch Connectors Cut PCB Test-Point Area

Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

Researchers at HRL Laboratories, LLC, have achieved a new milestone in 3D printing technology by demonstrating an approach to additively manufacture ceramics that overcomes the limits of traditional ceramic processing and enables high temperature, high strength ceramic components.

HRL’s Senior Chemical Engineer Zak Eckel and Senior Chemist Dr. Chaoyin Zhou invented a resin formulation that can be 3D printed into parts of virtually any shape and size. The printed resin can then be fired, converting it into a high strength, fully dense ceramic. The resulting material can withstand ultrahigh temperatures in excess of 1700°C and exhibits strength ten times higher than similar materials.

Ceramics are much more difficult to process than polymers or metals because they cannot be cast or machined easily. Traditionally ceramic parts are consolidated from powders by sintering, which introduces porosity and limits both achievable shapes and final strength.

“With our new 3D printing process we can take full advantage of the many desirable properties of this silicon oxycarbide ceramic, including high hardness, strength and temperature capability as well as resistance to abrasion and corrosion.” says program manager Dr. Tobias Schaedler.

The novel process and material could be used in a wide range of applications from large components in jet engines and hypersonic vehicles to intricate parts in microelectromechanical systems and electronic device packaging.

The HRL team’s research paper, “Additive Manufacturing of Polymer Derived Ceramics,” has been published in the January 1st issue of Science.

Related

Recent Posts

Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
42
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
43
Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

1.10.2026
18
Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

Antiferroelectric Hafnia at the 2D Limit

29.9.2026
37

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
53
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
40

Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design

16.6.2026
82

Imec Presents High-density MIMCAP RF interposer for III-V chiplets

15.6.2026
163

All‑Water Supercapacitor Based on 1‑nm Clay Channels and Nanoconfined Water Electrolyte

10.6.2026
118

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved