Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

    YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

    YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

    Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

    Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

    Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

    Isabellenhütte Introduces Flexible Heaters for Space Thermal Control

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

    YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

    YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

    Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

    Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

    Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

    Isabellenhütte Introduces Flexible Heaters for Space Thermal Control

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Buyer Boon: Digitization Forces Electronic Component Price Transparency

15.8.2017
Reading Time: 4 mins read
A A

source: EBNonline article
Adrien Sandrini, CEO, Precogs 8/10/2017
I’ve always been skeptical about the added value of those many weeks spent trying to renegotiate and obtain fair prices for the electronic components we purchase. Given the number of references, it looks more like inefficient data exchange sessions than real negotiations to seek win-win situations. However, this is likely to change, and that’s truly good news. 

The electronic component industry has always been prone to price discrepancies. It always strikes me how two different EMS/OEM/ODM can buy the same components with prices ranging from one to three times despite similar quantities.

RelatedPosts

Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

Bourns Releases 5 W Wide-Terminal Current Sense Resistors

While there are specific and concrete reasons behind those price discrepancies, I’m convinced that digitization will bring a new wave of transparency that will force commodity component prices to reach a worldwide equilibrium. This will lead to a new purchasing era that will be much more about speed-to-market, innovation, exclusivity, and gainsharing in supplier relationships than about harvesting three to five percent savings from contracts coming up for renewal.

Why such big discrepancies?

Before discussing digitization consequences, it’s important to understand why semiconductor prices are so different from one buyer to another.

Steep semiconductor learning curve

The learning curve is simply the long-term erosion of manufacturing costs related to production experience. The learning curve plays a critical role in the semiconductor industry since it is very, very steep.

As a former Intel executive told me: “We all disclose our fab utilization rate but the most secret metric is our yield.”

He then explained how a chipset is like a garden. To work limited-spaces as intensively as you can, you need to use space efficiently and to follow yield-maximizing strategies. In the garden, eliminate unnecessary pathways by planting crops in blocks rather than in rows, plant lettuce and spinach to grow in the shade of tomatoes, respect proper carrot spacing, plant crops that take a while — such as carrots — alongside faster-growing crops such as radishes, and so on.

The more experienced the gardener becomes, the more he knows how to design a high-yield garden.

Dies on a wafer are like small gardens. You can optimize their designs to shrink their sizes and drastically decrease production costs.

The more production experience is gained, the more you learn how to make an optimized product: designs are improved, die sizes are shrunk, process is debugged, wafer fab yields rise and even assembly yields rise. As yields rise more product is shipped per unit of cost, thus revenues rise while manufacturing costs stay constant or even decline, the average cost per device declines, leading to lower prices and higher volumes.

Price control mechanisms: Why doesn’t the learning curve help everyone?

Some customers will benefit from those lower costs: this is the case of high-volume customers on highly competitive markets (i.e. computer, communication, consumer). Those will surf down the curve and benefit from better prices.

However, some customers will only get a few percent price reduction every year, no matter what the production cost savings are. This is the case of high-mix, low-volume customers on less competitive markets (industrial, medical, military, aeronautic). Their products often have very long life cycles and huge safety requirements making it very complicated to redesign a product and change a component. As a result: manufacturers have no pressure to lower their prices since they are sure of keeping all the volumes for the next 10 or 20 years of product lifetime.

But this can only be true if manufacturers keep control over their distributors. Indeed, distributors have access to good prices thanks to high-volume customers. Manufacturers need to keep it clear that those good prices should be restricted to a few end customers only.

This is why  when you request a quote on a few manufacturing part numbers (MPN), distributors will always request you to disclose the customer part numbers (CPN), the end products and the end customers beforehand. They will then cross your information with the manufacturer price registration lists. If a price is registered, distributors will not be able to answer below a price (often high) fixed by the manufacturer.

Just an example to see how far the control can go: I went on an example of a high price (slightly higher than public online prices) on a high value reference ($500k/year, which starts to be high in Western countries). On one of the top authorized distributor website (that did not have the contract), I compared the price before, and after being logged with the customer login. Logged, the price was 80% higher than the public price! Higher, not lower!! Next, I used the login of another customer, and the price dropped 30% lower than the public price. The difference? +150% between those two customers for the same transaction.

Digitization will force price transparency

Those price control mechanisms are designed against price transparency. But I’m convinced the digital revolution to come will force price transparency, because digitization will empower buyers with real-time data on a global scale.

There are already signs that it has begun. The Internet brought worldwide publication of public prices thru e-commerce web sites. This led to online price comparison tools. As a result, manufacturer pricing policies tend to get global: previously per country, now per continent, and soon worldwide. A few years ago, one of our main activities was to provide real-time alerts when a negotiated price was higher than a public catalog price. Of course, this helps to correct a few price discrepancies. Already, Amazon is selling electronic components. I’m not sure they will accept custom prices per customer yet… And I’m sure manufacturers are under pressure to change their rules.

The new era of purchasing & supplier partnership

The good news is that price transparency will make the old line-by-line price negotiation obsolete for most components. Savings will be tied to annual rebates for reaching certain volumes or paying earlier.

Further, we will be more focused on making sure we have the right distributor and manufacturer portfolios to bring innovation and value to our end customers. We will seek for partners helping our go-to-market by identifying the best innovations. We will look for exclusive commercial relationships and for sharing supplier risks and rewards. And all this is a tenfold improvement over getting another penny off the unit price.

 

Related

Recent Posts

DigiKey Factory Tomorrow Season 6 graphic illustrating AI-ready industrial connectivity, data infrastructure and smart manufacturing networks.

DigiKey Factory Tomorrow Season 6 Explores AI-Ready Factories

1.10.2026
3
Sep 2026 electronics market heat map

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

30.9.2026
46
TDK and TAIYO YUDEN business alliance announcement for advanced MLCCs and inductors supporting AI infrastructure.

TDK and TAIYO YUDEN Explore Alliance for MLCCs and Inductors

29.9.2026
94
Metallized film capacitor winding with PEN, PET and polypropylene dielectric film layers shown in a power-electronics supply-chain concept

PEN Film Supply Challenges and Capacitor Replacement Paths

29.9.2026
16
Rheinmetall Pierburg Pump Technology NanoLam DC-link capacitors for high-power electric vehicle traction inverter applications

Rheinmetall Funds NanoLam Capacitor Production Scale-Up

22.9.2026
72

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
104
ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

10.9.2026
63

Emerging Capacitor Markets in Fusion Energy

10.9.2026
82
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
177

Upcoming Events

Oct 9
18:00 - 19:00 CEST

Edgewater Research 3Q26 Electronic Components Review Outlook Webinar

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved