Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

ECIA January 2026 Reports Strong Sales Confidence

19.2.2026
Reading Time: 4 mins read
A A

ECIA’s January 2026 survey signals the strongest sales sentiment for the electronic components industry in more than four and a half years. The January 2026 results show broad-based confidence across product categories, end-markets, and all major supply chain channels as the industry enters the 2026.

Overall Sales Sentiment at Multi‑Year High

The overall average index score for electronic component sales sentiment reached 138.0 in January 2026 and is projected to rise further to 143.4 in February. This marks the eighth consecutive month with the total index above 110, clearly above the neutral threshold of 100 that separates positive from negative sentiment. Only the March through May 2021 period produced stronger readings in the survey’s history.

RelatedPosts

ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

ECIA February 2026 Industry Pulse Signals Strong Component Growth

October 2025 ECIA US Components Sales Sentiment Remains Strong but Weakens in November

Industry participants across the authorized supply chain report a notably positive self‑assessment as 2026 begins. The consistently elevated sentiment suggests that recent improvements are not short‑lived, but rather part of an extended upswing in demand and confidence.

Segment Highlights – Semiconductors, Passives, and Electro‑Mechanical

Despite a modest decline of 7.6 index points from December to January, the Semiconductor category remained the strongest of the three major product segments with a score of 140.0. Passive components recorded a sharp 16.7‑point month‑over‑month surge to 139.6, nearly closing the gap to Semiconductors. Electro‑Mechanical and Connectors achieved a solid score of 134.5, reflecting a modest but meaningful improvement.

Looking ahead to February, survey participants expect the Electro‑Mechanical and Passive components categories to maintain their strong sales sentiment with only minor adjustments. Semiconductors, in contrast, are projected to exhibit an exceptional jump in strength, with the segment’s overall index forecast to leap to 154.5. Within Semiconductors, Memory ICs stand out with record‑breaking scores of 180 for both January and the February outlook, indicating exceptionally strong demand.

While MCU and MPU devices and Analog or Linear ICs are comparatively weaker within the semiconductor space, their index scores still fall between 120 and 140. This places them well within positive territory and confirms that momentum is broadly distributed, even among the less heated sub‑segments.

End‑Market Outlook – Broad‑Based Demand Strength

End‑market sentiment improved significantly in January, bringing it into alignment with the strong product category scores. The overall end‑market index reached 135.1 in January and is expected to remain relatively stable into February, indicating that customers across application areas share the positive outlook.

Every tracked end‑market segment posted index scores above 100 for both January and the February forecast. Optimism is particularly strong in Avionics, Military, and Space, as well as Industrial applications, where ongoing programs and investment cycles continue to support elevated demand. The combination of strong product and end‑market readings reinforces the view that the current strength is not confined to a narrow set of applications.

Supply Chain Sentiment Across Channel Partners

All major supply chain participant groups reported firmly positive sentiment in January and for the February outlook. Manufacturer Representatives recorded the strongest sales sentiment scores, followed by Distributors. Manufacturers, while more conservative in their assessments, still reported solidly positive results across all categories.

Notably, every product and channel combination achieved index scores at or above 100 in both January and the early‑2026 outlook. This across‑the‑board alignment suggests a high level of confidence and consistency among different parts of the authorized supply chain, from production through to the sales interface with end customers.

Rising Lead Time Pressure and Memory Supply Concerns

Alongside the strong demand outlook, lead time pressures are increasing, particularly for Semiconductors. More than half of survey participants report longer lead times for semiconductor devices, and nearly 40% of all respondents see lead times increasing across the board, compared to only 8% who report shortening lead times.

Advanced memory ICs are under the greatest strain. DRAM and NAND Flash show especially acute pressure, with 75% and 67% of respondents respectively reporting increasing lead times for these devices. The acute mismatch between supply and demand for advanced memory ICs is emerging as a major concern for the health of the broader electronics components market.

Tight availability of these critical components poses a risk of stalled or delayed sales in other product segments and end‑markets that depend on them. As the industry moves further into 2026, managing memory IC supply has become one of the most critical priorities in supply chain planning and risk mitigation.

Source

This article is based on information and data provided in an ECIA Industry Pulse and ECST report press release prepared by ECIA’s chief analyst and the association’s research team.

References

  1. ECIA Industry Pulse January 2026 Outlook Article (PDF)

Related

Recent Posts

Würth Elektronik Expanded Capacity for Validation and Services in Asia

16.4.2026
11

YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

16.4.2026
58

ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years

13.4.2026
46

TDK and Nippon Chemical Launch Joint Venture for MLCC Materials

7.4.2026
48

March 2026 Interconnect, Passives and Electromechanical Components Market Insights

2.4.2026
103

Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

1.4.2026
16

APEC 2026 Power Electronics Trends and Implications for Passive Components

1.4.2026
128

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

31.3.2026
30

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

31.3.2026
58

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version