Electromagnetic compatibility (EMC) is decided in the schematic and layout, not in the test chamber. This article distills key lessons...
Read moreDetailsHirose’s new BK19 series is an ultra‑miniature single‑row FPC‑to‑board connector that combines signal and power in one interface for space‑constrained...
Read moreDetailsMolex has expanded its AirBorn SInergy modular high-speed hybrid connector platform with new high-power modules that deliver up to 25.0...
Read moreDetailsHirose Electric’s new FX36 series is a 0.5 mm pitch board-to-board connector with a floating and vibration absorption structure designed for...
Read moreDetailsHirose’s ZE150HV and ZG05HV connector families are compact wire‑to‑board solutions for high‑voltage circuits in electric and hybrid vehicles as well...
Read moreDetailsYAGEO’s new JXF0‑series PulseJack integrated connector modules (ICMs) combine a compact RJ45 jack with integrated magnetics and 90 W PoE+...
Read moreDetailsThe Binder B23 series is a new generation of hybrid circular connectors that combines power and shielded Ethernet in a...
Read moreDetailsM12 circular connectors are a staple interface in industrial automation for carrying sensor signals, communication data and low‑voltage power in...
Read moreDetailsKyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch...
Read moreDetailsThermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids...
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© EPCI - Leading Passive Components Educational and Information Site