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    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

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    Ripple Steering in Coupled Inductors: SEPIC Case

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    Exxelia Exhibit at Electronica India September 17–19, 2025

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    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

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    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

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    Switched Capacitor Converter Explained

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Heraeus Electronics and Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology

29.6.2023
Reading Time: 2 mins read
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Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement. The agreement allows Heraeus Electronics to access a valuable patent portfolio from Bosch to accelerate the development of their inorganic potting compound, CemPack®, for encapsulation of power modules.

“The combination of expertise between Heraeus and Bosch enables a new type of encapsulants that will bring power electronic packages to the next level so that these packages can unfold the full potential of a new generation of semiconductors,” said Dr. Klemens Brunner, Head of Heraeus Electronics.

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The encapsulation material offers superior thermal conductivity (>5 W/m/K) and extreme temperature resistance (up to 300°C), enabling increased power densities and improved reliability. The license agreement also allows the extension of the application spectrum to encapsulation of passive components (magnetic inductors, capacitors, or resistors), electric motors (stators), or other devices where a thermal bridge to a heat sink is required while ensuring protection against the environment.

“Collaborations like these show the importance of open innovation to speed up development cycles and it is a great example for the innovation power of Heraeus,” said Michael Jörger, Head of Business Line Power Electronic Materials at Heraeus Electronics.

“We are excited to share our knowledge and IP of this new technology with Heraeus to deliver inorganic potting compounds meeting the highest standards of performance and reliability. Like Bosch, Heraeus is committed to excellence and has a reputation of shaping the market with innovative products,” said Dr. Peter Wolfangel, EVP Corporate Sector Research and Advance Engineering at Bosch.

The agreement is significant given the increasing demand for power modules as key components of the transition towards electrification. With its existing material portfolio for packaging and interconnection of semiconducting power dies, Heraeus Electronics already offers cutting-edge solutions for power electronics such as sinter paste, DTS, and Ag-free AMB.

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Source: Heraeus

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