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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

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    Choosing the Right Capacitor: The Importance of Accurate Measurements

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Knowles Offers Leaded Standoff MLCC for Automotive Applications

15.2.2024
Reading Time: 2 mins read
A A

To help PCBs and other physically connected components survive vibration, board bending, thermal mismatching, and stress during thermal cycling, Knowles Precision Devices has launched a range of leaded standoff components, Metal Frame J-Lead Terminal MLCCs, that are qualified to AEC-Q200.

AEC-Q200 is the global standard for stress resistance in passive electronic components in automotive applications. 

RelatedPosts

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Knowles Metal Frame J-Lead Terminal MLCC ceramic capacitors offer enhanced performance under critical testing conditions, including thermal shock and mechanical vibrations.

These high-reliability parts are capable of 3,000 thermal cycles with no degradation of interconnects when mounted on an FR4 board. Compared to a surface-mounted chip, lead flexibility accommodates much more board bending and flexing before internal cracks form.

In arrangements with many components clustered on a board, leaded standoffs are advantageous because they position ceramic elements off the board, ultimately providing more design flexibility. With high voltage ratings, standoffs can help control flashover across the component surface as well. 

Features

  • Options for case sizes 2220 and 2225 in all ranges
  • Enhanced performance under critical testing conditions such as thermal shock and mechanical vibration
  • “J” type leads with a double tabbed connection to MLCC terminals
  • Voltage ratings up to 6kV
  • 3kV and 4kV options to satisfy the demands of DWV testing for 800V battery systems
  • Suitable for industrial and automotive markets

Applications

  • Battery Management
  • EV and HEV
  • Applications Requiring High Voltage Performance Where Stability Under Temperature and Voltage is Critical
  • DC-DC Converters
  • Wireless Charging Resonant Tank
  • PTC Heater Controller

Related

Source: Knowles Precision Devices

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