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    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

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    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

    Samtec Releases 800-Position High-Performance Array Connectors  

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Ripple Steering in Coupled Inductors: SEPIC Case

    TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

    Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

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    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

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Modelithics Announces COMPLETE+3D Library v25.0 for Ansys HFSS

10.3.2025
Reading Time: 2 mins read
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Modelithics® has announced the release of the Modelithics COMPLETE+3D Library v25.0, a significant enhancement to the library’s capabilities.

This release introduces approximately 28,000 circuit simulation models and ~7000 3D EM / 3D Brick EM™ models, making it an ideal tool for full-wave electromagnetic simulations. The library is compatible with Ansys HFSS 2025 R1 and backward compatible with previous Modelithics library releases.

RelatedPosts

Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

Modelithics Announces v25.5 of the COMPLETE+3D Library for Ansys HFSS

Modelithics Library Expands with 120 New Models

Among the new additions are 3D EM models for 19 single-layer capacitors from Tecdia, each validated up to 60 GHz. Additionally, a new 3D Brick EM model is available for the Kemet CBR01 series capacitor, validated to 67 GHz. For more detailed information on Modelithics 3D Brick EM models, refer to Application Note 78.

The release also includes approximately 30 new Microwave Global Models™ for capacitor, inductor, and resistor families from International Manufacturing Services (IMS), Kemet Yageo Group, KYOCERA-AVX, Murata, Samsung, Susumu, Knowles-Syfer, and Voltronics.

Each Microwave Global equivalent circuit model incorporates advanced Modelithics features such as Part-Value Scaling, Substrate Scaling, Pad Scaling, representation of high-order resonant effects, and accurate Effective Series Resistance. Notably, a single Microwave Global Model covers the entire range of part values for a vendor part series.

In addition to this release, we’ve introduced a new model for the MACOM MACR-011020 varactor and the Microchip MV3903-P2010 varactor. Both of these varactors are validated up to 67 GHz and are substrate and temperature scalable. We’ve also added new models for attenuators from Smiths Interconnect, IMS, and Aeroflex, as well as new models for 18 packages from Vishay-Barry.

Furthermore, through the Modelithics Vendor Partner program, we’re offering FREE 90-day access to Modelithics models for Kyocera-AVX, IMS, Kemet, Tecdia, and Smiths Interconnect components.

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Source: Modelithics

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