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    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

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Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

19.10.2026
Reading Time: 5 mins read
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Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

Modelithics has released COMPLETE+3D Library version 26.4 for Keysight ADS/RFPro, adding automatic 3D model selection, enhanced layout integration and broader measurement-based model coverage for RF, microwave and millimetre-wave design.

Announced on October 14, 2026, the update combines workflow improvements with new models for passive components, packages, connectors and nonlinear devices. For engineers developing high-frequency circuits, the practical focus is on keeping component selections consistent between circuit simulation and full-wave 3D electromagnetic analysis.

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Modelithics COMPLETE v26.4 Expands RF Passive Models for Keysight ADS

Automatic 3D View Selection Connects Circuit and EM Design

A central addition is Automatic 3D View Selection, which automatically updates the associated RFPro 3D models when component values change.

This addresses an important transition in high-frequency design: a component selected or optimised in the circuit simulator must remain correctly represented when the design moves into electromagnetic simulation. Automating that association can reduce manual model-selection work and the risk of using a 3D representation that no longer matches the circuit configuration.

Version 26.4 also introduces Smart Mount Layouts, extending integration with Keysight ADS Smart Mount technology for a growing range of component models. Modelithics positions this enhancement as a way to simplify high-frequency PCB and laminate design workflows.

Expanded Models for Passives, Packages and Connectors

The release broadens the library across both discrete components and interconnect structures. Manufacturer-highlighted additions include:

  • 56 new TDK inductor models.
  • 89 new 3D package and connector models from Barry, Gigalane, RJR Technology and SV Microwave.
  • New filter and coupler models from Mini-Circuits and TTM.
  • New capacitor and resistor Microwave Global Models from manufacturers including Kyocera-AVX, Cornell Dubilier, IMS, Murata, Spectrum Control, Syfer, Tecdia, TTM Tech and Vishay.
  • 26 new Microchip PIN diode and varactor models.
  • Six nonlinear transistor models from Guerrilla RF.
  • A new Mini-Circuits amplifier model, alongside additional attenuator, filter, coupler and connector models.

For designers working with RF inductors and filters, the expanded coverage is relevant because nominal inductance alone does not describe high-frequency performance. Quality factor, parasitic capacitance and self-resonance also influence circuit behaviour.

The additional package and connector models address another part of the same problem: the electrical response of the assembled design depends on more than the schematic’s discrete components.

Microwave Global Models Extend High-Frequency Coverage

Modelithics says the expanded Microwave Global Models offering extends validated coverage to frequencies as high as 150 GHz while retaining advanced scalability features.

That figure should be understood as the upper reach of the stated model coverage, not as a universal validation limit for every model in the release. Engineers should check the frequency range and supported parameters of the specific model selected.

Microwave Global Models use measurement-based, scalable representations rather than relying solely on ideal component values. Modelithics has described scalability with respect to component value, substrate and solder-pad dimensions, allowing supported models to represent changes that matter during tuning and optimisation.

This is particularly relevant to MLCC capacitors for RF and microwave applications, where losses and parasitic behaviour can become as important as nominal capacitance.

What the Update Means for RF Design Teams

The release brings together two complementary improvements: broader component coverage and a more connected circuit-to-3D simulation workflow.

Circuit models support component selection and optimisation, while full-wave 3D electromagnetic simulation addresses geometry-dependent effects. Keeping those representations aligned becomes increasingly important as operating frequencies rise and packages, mounting structures and interconnects become significant parts of the circuit response.

For design teams evaluating version 26.4, the practical checks are therefore model-specific: confirm coverage for the intended component family, verify the validated frequency range, and establish whether the required scalability and 3D workflow features are available for that model.

Modelithics presents the release as supporting shorter development cycles and improved first-pass design success across communications, automotive, aerospace, defence and other high-frequency applications. The announcement does not provide a quantified benchmark for those improvements.

Further reading

  • Modelithics Microwave Single-Layer Capacitors Modeling
  • Inductance, Impedance, Q Factor and DCR Losses
  • Inductor Resonances and Their Impact on EMI

Source

This article is based on the Modelithics manufacturer press release dated October 14, 2026, announcing COMPLETE+3D Library version 26.4 for Keysight ADS/RFPro. Additional technical context draws on Passive Components Blog coverage of scalable component models and high-frequency passive-component behaviour. Model counts, new features and frequency-coverage statements are attributed to Modelithics.

References

  1. Modelithics COMPLETE+3D Library v26.4 manufacturer press release.
  2. Modelithics and Johanson Technology to Develop New Microwave Ceramic Capacitor Models.
  3. RF Inductors and Filters: Guide to Selection, Design and Applications.

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