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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

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Murata introduces 0201 inch audio line noise filter for smart phones

6.2.2018
Reading Time: 1 min read
A A

source: Murata news

Murata Manufacturing Co., Ltd. has introduced the NFZ03SG_SN series of audio line noise filters at a size of 0201 inch size (0.6×0.3mm), which is the smallest size in the industry. Mass production of these products began in January 2018.
In recent years, high sound quality has been emphasized as one of the selling points of smart phones and portable audio devices, and audio quality level has been a significant feature by which consumers choose devices. In order to counteract noise, the audio circuits used in these devices must include a noise suppression filter. However, noise suppression filters produce audio distortion, and thus cause a loss in sound quality.

RelatedPosts

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

SCHURTER THT DIP Switches Support Hardware-Level Configuration

NFZ03SG_SN series make use of our proprietary material technology to suppress audio distortion that occurs when audio circuits are used, in order to efficiently eliminate noise while maintaining high sound quality.

Characteristics

  • 330 to 1600 ohm at 900 MHz
  • Designed to have an impedance peak at communication frequencies
  • 0.6 x 0.3 mm size

Impedance characteristics


Audio distortion characteristics (THD+N)

 

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