Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs

29.7.2026
Reading Time: 6 mins read
A A

Bourns has introduced a set of compact LTCC band pass filters aimed at 5G C‑band RF front‑end designs, covering key frequency ranges between 3300 MHz and 5000 MHz.

These multilayer ceramic filter devices integrate multiple passive elements into a single monolithic structure, offering small footprints and controlled insertion loss for dense radio boards in base stations, FWA equipment, and private 5G networks.

RelatedPosts

Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

Key features and benefits

  • Compact LTCC multilayer construction that integrates inductive and capacitive elements into a single ceramic block, reducing discrete component count and layout complexity in RF front‑end filter networks.
  • Frequency coverage tailored to 5G C‑band allocations, with models spanning 3300–4200 MHz and 4400–5000 MHz, suitable for eMBB, FWA, and private 5G deployments using C‑band carriers.
  • Small package sizes down to 1.6 × 0.8 × 0.35 mm, enabling placement close to RFICs where routing space and matching network real estate are tight.
  • Documented maximum insertion loss in the range of approximately 0.9 dB to 1.7 dB at 25 °C, helping designers budget gain and noise figure across the receive and transmit chains.
  • Operating temperature ranges from −40 °C to +85 °C for two models and up to +105 °C for the largest device, making the series suitable for outdoor radio units and thermally stressed enclosures.
  • RoHS‑compliant construction according to Bourns’ published compliance statement, supporting adoption in global telecom and industrial designs without additional material qualification effort.

Typical applications

These LTCC band pass filters target RF front‑end sections where narrowband filtering around the 5G C‑band is required and board space is limited. They can be used in both transmit and receive paths to define passbands and attenuate adjacent channels or out‑of‑band interference.

  • 5G C‑band macro and small cells (eMBB) where compact filter networks must fit close to power amplifiers and low noise amplifiers.
  • Fixed Wireless Access customer premises equipment and outdoor units using C‑band carriers for high‑capacity point‑to‑multipoint links.
  • Private 5G networks in industrial campuses where frequency‑selective filtering helps manage coexistence with other wireless systems in shared spectrum.
  • RF modules and front‑end boards in OEM radio subsystems that require documented, catalog LTCC filters rather than custom ceramic filters.

In practice, these devices will sit in the RF chain after the antenna and duplexer, often in combination with matching networks and additional filters to define the overall front‑end response.

Technical highlights

The FBP series currently consists of three LTCC band pass filter models with defined electrical characteristics and mechanical dimensions. The table below summarizes the key published parameters at 25 °C.

FBP LTCC band pass filters – key parameter

ModelSize (mm)Frequency range (MHz)Max insertion loss @ 25 °COperating temperature
FBP1604N470L31.6 × 0.8 × 0.44400 – 50001.5 dB max−40 °C to +85 °C
FBP1608N375L31.6 × 0.8 × 0.353300 – 42001.7 dB max−40 °C to +85 °C
FBP2007N470L32.0 × 1.25 × 0.654400 – 50000.9 dB max−40 °C to +105 °C

All models are specified as LTCC band pass filters, meaning that they pass a defined band of frequencies and attenuate signals outside that band according to the manufacturer’s datasheet. The combination of compact mechanical size and controlled insertion loss allows integration into high‑density radio boards without significantly degrading system‑level performance.

From a practical standpoint, the lower insertion loss of the FBP2007N470L3 at higher temperatures can be beneficial in transmit chains where efficiency and thermal margins are critical, while the smaller footprints of the 1.6 mm devices are attractive near RFICs and in space‑constrained modules.

Design‑in notes for engineers

When designing these LTCC band pass filters into a 5G C‑band RF front‑end, engineers should consider both RF performance and mechanical integration aspects.

  • Check frequency allocations and channel plan
    Verify that the passband of the chosen FBP model aligns with the specific C‑band allocation and channelization for the target network and region, paying attention to edge frequencies and guard bands.
  • Budget insertion loss in the RF chain
    Include the specified maximum insertion loss in the overall gain and noise figure calculations for the receive and transmit paths, particularly when cascading multiple filters and matching networks.
  • Account for temperature range and derating
    Ensure the operating temperature range of the selected device matches the expected ambient and junction temperatures in outdoor radios, and review manufacturer curves for any temperature‑dependent performance shifts according to the datasheet.
  • Layout and grounding practices
    Place the LTCC filters close to the associated RFICs with controlled impedance traces, solid RF ground, and minimal via inductance to preserve the intended filter response and reduce parasitics.
  • EMC and coexistence considerations
    Use the band pass characteristics to help manage out‑of‑band emissions and susceptibility, especially in multi‑radio platforms where different bands share the same enclosure or antenna structures.
  • Qualification and compliance
    Leverage the RoHS‑compliant status and documented characteristics in internal component libraries and AVL processes, and cross‑check long‑term availability through Bourns’ distribution channels.

For detailed S‑parameters, recommended land pattern, and performance plots over temperature and frequency, engineers should refer directly to the manufacturer datasheets for each part number rather than extrapolating beyond the published curves.

Source

This article is based on information provided in the official Bourns press release announcing the FBP series LTCC band pass filters for 5G C‑band RF front‑end designs, together with the associated product documentation available from the manufacturer.

References

  1. Bourns press release – FBP Series LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs
  2. Bourns FBP1604N470L3 product datasheet
  3. Bourns FBP1608N375L3 product datasheet
  4. Bourns FBP2007N470L3 product datasheet
  5. Bourns – Request Samples

Related

Recent Posts

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

3.9.2026
17

Modelithics COMPLETE v26.4 Expands RF Passive Models for Keysight ADS

28.8.2026
12

Bourns Introduces LTCC GNSS L‑Band Diplexer for Compact RF Front Ends

24.7.2026
54

Modelithics Extends Models for Microchip PIN and Varactor Diodes

23.7.2026
37

RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

9.7.2026
130

High-Q RF & Microwave MLCCs: A Cross-Vendor Benchmark

2.7.2026
196

KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

25.6.2026
142

Coilcraft Releases 0402 Ferrite-Core Wirewound Chip Inductors for RF and EMI Control

25.6.2026
84

Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

19.6.2026
79

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved