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    Bourns Extends Rotational Life Option for its Guitar Potentiometer

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    Modeling and Simulation of Leakage Inductance

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    Bourns Extends Rotational Life Option for its Guitar Potentiometer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    TAIYO YUDEN Releases Compact SMD Power Inductors for Automotive Application

    Fischer Releases High Vibration Robust Ratchet Locking USB-C Connector System

    Littelfuse Unveils High-Use Tactile Switches with 2 Million Cycle Lifespan

    KYOCERA AVX Releases Compact High-Directivity Couplers

    Supercapacitors Emerge as a Promising Solution to AI-Induced Power Energy Spikes

    Wk 18 Electronics Supply Chain Digest

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    VPG Demonstrates Precision Resistor in Cryogenic Conditions

    Comparison Testing of Chip Resistor Technologies Under High Vibration

    EMC Challenges for High Speed Signal Immunity and Low EMI

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Murata Interview on the 5G Big Bang and How it Will Influence the Market

28.10.2020
Reading Time: 2 mins read
A A

The 5G big bang is coming, this will herald many new applications and pose new challenges to existing devices. In this video from David Kirk – President of Murata Electronics America we explore how 5G will affect industry and how manufacturers will need to prepare.

5G Challenges

The long-awaited 5G rollout is underway. Consumers in more than 20 countries can now access 5G speeds on their smartphones. 
Over the next few years, standardization will pave the way for huge throughput, latency and availability enhancements that promise to unleash the benefits of 5G to many new industries and applications. 

RelatedPosts

Bourns Extends Rotational Life Option for its Guitar Potentiometer

Modeling and Simulation of Leakage Inductance

Power Inductor Considerations for AI High Power Computing – Vishay Video

For organizations to achieve the promised commercial success, however, the 5G ecosystem will have to mitigate component-level risks around many issues, including:

  • Thermal Management
  • Battery Life
  • Low Latency
  • Miniaturisation
  • Scalability

5G Market

High performance components for 5G, from infrastructure, through handsets to miniaturized IoT devices will be needed for development of critical hardware in the fields like:

  • Enhanced mobile broadband (eMBB) delivering much faster, low-latency and massive machine type communications (mMTC) to optimise user experience and herald many applications.
  • Massive IoT for applications that are less latency sensitive and have relatively low throughput requirements, but require a huge volume of low-cost, low-energy consumption devices on a network with excellent coverage.
  • Ensuring secure communications to first responders, governments and industries. From dedicated networks to commercial mobile networks with specialist embedded mission-critical capabilities.
  • Private network with unified connectivity, secure means of communication within a specific area. It will deliver the speed, latency and other benefits promised by 5G to support next-generation applications.

Related

Source: Murata

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