Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Murata Introduces World’s Smallest SAW Filters for Denser Circuit Design and 5G Smartphones

16.7.2019
Reading Time: 4 mins read
A A

Source: Murata news

Murata Manufacturing Co., Ltd. has developed and started volume production of the world’s smallest*1 SAW*2 duplexers*3—the SAYAV Series, SAYARV Series, and SAYAP Series; and SAW filters—the SAFFW Series (hereinafter “the Products”).
*1 Based on an internal study, as of the end of June 2019.
*2 An acoustic wave traveling along the surface of a material (SAW: Surface Acoustic Wave).
*3 Devices that allow transmitters and receivers to share a common antenna while electronically splitting the transmission and receiving lines.

RelatedPosts

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

Wk 42 Electronics Supply Chain Digest

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

The steady improvement in smartphone performance is driving the demand for more compact electronic components. In particular, there is an acute need for smaller SAW devices that transmit and receive signals at certain frequencies. In order to support multiple band operation, middle-class smartphones for specific regions use 14 or 15 SAW devices while premium models with global compatibility may adopt as many as 30 to 40 SAW devices.

By fully revising the chip design and packaging approach making use of its own proprietary design and miniaturization technology, Murata has developed the Products with characteristics equal or superior to those of conventional products while simultaneously achieving the world’s smallest size.

Highlights
The key features of the Products are as follows:

The World’s Smallest SAW Devices.

The SAYAV Series, SAYRV Series, and SAYAP Series of SAW duplexers supporting the 700MHz to 2.6GHz bands are packaged in 1.6mm x 1.2mm (length x width) form factor, and SAFFW Series of SAW filters are packaged in a 0.9mm x 0.7mm (length x width) form factor, making the duplexers approx. 24% and the filters approx. 37% smaller than conventional models*4. This makes possible significant reductions in mounting area on electronic circuits and contributes to high-density circuit design.
*4 Compared with a 1.8mm x 1.4mm SAW duplexer and a 1.1mm x 0.9mm SAW filter, respectively

Realizing Characteristics Equal or Superior to Those of Conventional Products

By leveraging its own design and miniaturization technology, Murata has achieved excellent characteristics while minimizing the degradation of characteristics associated with reduced size. The Products exhibit transmission*5 and isolation characteristics*6 equal or superior to those of conventional products. They are also among the first such products to realize improved power durability that meets the higher power requirements that will be required by future smartphones beginning with those being developed for use with the 5th generation mobile communications system (5G).

*5 The degree of transmission loss between the antenna and the transmitting/receiving circuits
*6 A characteristic that separates the filtering functions for transmitting and receiving in duplexers

A Lineup Covering the Major Frequency Bands

The lineup includes products compatible with the major frequency bands of the frequency band classification standard defined by the standardization organization 3GPP*7.

Lineup and supported frequency bands

SAW duplexer SAW filter
Band P/N Band P/N
1 SAYAV1G95BA0F0A 1 SAFFW2G14AA0E0A
2 SAYAP1G88BA0C0A 2 SAFFW1G96AA0E0A
3 SAYRV1G74BC0C0A 3 SAFFW1G84AA0E0A
5 SAYRV836MBA0F0A 5 SAFFW881MAA0E0A
7 SAYRV2G53BA0E0A 7 SAFFW2G65AA0E0A
8 SAYRV897MBA0C0A 8 SAFFW942MAA0E0A
20 SAYAP806MBA0C0A 40 SAFFW2G35AA0E0A
41 SAFFW2G59AA1E0A
GNSS SAFFW1G56AA0E0A
ISM2.4GHz SAFFW2G45MA0E0A

*7 An acronym of Third Generation Partnership Project, a standards organization that studies and develops the standard specifications of mobile communication systems for 3G and beyond.

Murata will expand this product lineup to support major communications bands between 700MHz and 2.6GHz by the end of FY2019. The company is also developing products compatible with the sub-6 GHz and the 3GHz to 6GHz bands that are expected to be used in 5G. Murata will continue developing smaller products that meet the needs of the market and of its customers, in order to contribute to saving space on electronic circuit boards and facilitating high-density circuit design.

Other Technical Information
In the communication environment based on the 4th generation mobile communications system (4G), the range of frequency bands that smartphones need to support has increased, while new wireless technologies designed to improve communications quality such as carrier aggregation*8 and MIMO*9 have been developed. Moreover, the full adoption of 5G is expected to lead to more complex RF circuits that will play a role in both transmission and receiver.

The Products are discrete devices equipped with a single duplexer or filter function. Premium smartphone models that are required to be compatible with a large number of frequency bands employ small modules that incorporate multiple SAW devices corresponding to different frequency bands in a single compact package.

In future, Murata will work to further reduce the size of these modules by harnessing the proprietary design and miniaturization technology employed in the development the Products.

*8 A technology for improving communication speed by combining multiple carriers into one data channel
*9 An acronym of multiple-input and multiple-output, MIMO improves the speed of communication by employing multiple transmitting and receiving antennas.

Related

Recent Posts

Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

15.10.2026
21
Bourns CRT-TN TaN thin-film chip resistors in 0402, 0603, 0805 and 1206 package sizes

Bourns Releases TaN Thin Film Resistors Target Precision Circuits

1.10.2026
23
Würth Elektronik electronica 2026 presentation featuring electronic components, PCB technologies and high-current PowerBusbar connection solutions.

Würth Elektronik Previews Components, PCBs and Power Solutions at electronica 2026

30.9.2026
31

KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

3.9.2026
66

Vishay IFBT SMT Flyback Transformers Target PoE and Isolated DC/DC Designs up to 30 W

28.8.2026
36

Bourns Introduces LTCC Band Pass Filters for 5G C‑Band RF Front‑End Designs

29.7.2026
57

Bourns Introduces LTCC GNSS L‑Band Diplexer for Compact RF Front Ends

24.7.2026
60

RF Filters and Passive Components Enabling the 7 Missile RF Subsystems

9.7.2026
147

100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

26.6.2026
419

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved