Vishay Introduced Thin Film Submount Platform for Optical and RF Modules
Vishay has introduced a thin film submount platform aimed at high speed optical transceivers, RF modules, and advanced electronic packaging ...
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Murata Introduces Crystal and NTC Set for Automotive UWB Timing
Murata has introduced a discrete timing solution that combines a high‑precision crystal unit with an external NTC thermistor to meet ...
Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
Kyocera has introduced a multilayer ceramic core substrate aimed at advanced AI semiconductor packages such as high‑end xPUs and switch ...
Modeling Fringing Field Losses in Inductors & Transformers
Fringing field effects at air gaps represent a significant but often underestimated source of additional winding losses in magnetic components. ...
YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs
YMIN has introduced ultra‑low‑profile polymer tantalum capacitors in the 47–100 µF / 35 V range specifically targeted at power‑loss protection ...
Littelfuse Expands High-Voltage TVS Diodes
Littelfuse has expanded its TP Series with high-voltage TPSMC TPSMD and TP5.0SMDJ transient voltage suppression (TVS) diodes designed for automotive ...
DigiKey Adds 31k New In‑Stock Parts in Q1 2026
DigiKey significantly expanded its in‑stock portfolio in Q1 2026, adding tens of thousands of new stocking parts and nearly one ...
Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating
This article, authored by Vladimir Azbel, Ph.D., a semiconductor process reliability engineer consultant, delves into the intricate process of miniaturizing tantalum ...
Heatsink Design and Thermal Interface Materials for Reliable Electronics
Thermal management is a challenge for any electronics designer. Among the possible solutions, heatsinks are a key element that aids ...
Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%
Murata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs) that dramatically reduces packaging material ...
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