Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

    TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

    Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

    TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

    Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

    Littelfuse C&K SDE End-Stackable SMT DIP Switches

    Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

    Bourns Releases BMS Transformer with 3.5 mm Height

    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK M704 and M705 NTC temperature sensors with a leaded plastic housing and metal-tag ring-lug assembly

    TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

    Conceptual illustration for Modelithics COMPLETE 26.5 showing RF capacitors, inductors and resistors on a microwave PCB.

    Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

    TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

    Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

    Littelfuse C&K SDE End-Stackable SMT DIP Switches

    Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

    Bourns Releases BMS Transformer with 3.5 mm Height

    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers Developed Wood-Derived Insulating Dielectric Ink and Demonstrated Fully Recyclable Printed Electronics

15.6.2022
Reading Time: 4 mins read
A A
A 3D rendering of the first fully recyclable, printed transistor; credit: Duke University

A 3D rendering of the first fully recyclable, printed transistor; credit: Duke University

Engineers at Duke University have developed the world’s first fully recyclable printed electronics. By demonstrating a crucial and relatively complex computer component — the transistor — created with three carbon-based inks, the researchers hope to inspire a new generation of recyclable electronics to help fight the growing global epidemic of electronic waste. The work appears online April 26 in the journal Nature Electronics.

“Silicon-based computer components are probably never going away, and we don’t expect easily recyclable electronics like ours to replace the technology and devices that are already widely used,” said Aaron Franklin, the Addy Professor of Electrical and Computer Engineering at Duke. “But we hope that by creating new, fully recyclable, easily printed electronics and showing what they can do, that they might become widely used in future applications.”

RelatedPosts

TDK M704 and M705 NTC Sensors for High-Voltage Power Systems

Modelithics COMPLETE 26.5 Adds RF Passive Models for AWR

TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

As people worldwide adopt more electronics into their lives, there’s an ever-growing pile of discarded devices that either don’t work anymore or have been cast away in favor of a newer model. According to a United Nations estimate, less than a quarter of the millions of pounds of electronics thrown away each year is recycled. And the problem is only going to get worse as the world upgrades to 5G devices and the Internet of Things (IoT) continues to expand.

Part of the problem is that electronic devices are difficult to recycle. Large plants employ hundreds of workers who hack at bulky devices. But while scraps of copper, aluminum and steel can be recycled, the silicon chips at the heart of the devices cannot.

In the new study, Franklin and his laboratory demonstrate a completely recyclable, fully functional transistor made out of three carbon-based inks that can be easily printed onto paper or other flexible, environmentally friendly surfaces. Carbon nanotubes and graphene inks are used for the semiconductors and conductors, respectively. While these materials are not new to the world of printed electronics, Franklin says, the path to recyclability was opened with the development of a wood-derived insulating dielectric ink called nanocellulose.

Insulating cellulose is printed onto other carbon-based components to produce the first fully recyclable printed transistor. Researchers hope to inspire a new generation of recyclable electronics to help fight the growing global epidemic of electronic waste. credit: Duke University

“Nanocellulose is biodegradable and has been used in applications like packaging for years,” said Franklin. “And while people have long known about its potential applications as an insulator in electronics, nobody has figured out how to use it in a printable ink before. That’s one of the keys to making these fully recyclable devices functional.”

The researchers developed a method for suspending crystals of nanocellulose that were extracted from wood fibers that — with the sprinkling of a little table salt — yields an ink that performs admirably as an insulator in their printed transistors. Using the three inks in an aerosol jet printer at room temperature, the team shows that their all-carbon transistors perform well enough for use in a wide variety of applications, even six months after the initial printing.

The team then demonstrates just how recyclable their design is. By submerging their devices in a series of baths, gently vibrating them with sound waves and centrifuging the resulting solution, the carbon nanotubes and graphene are sequentially recovered with an average yield of nearly 100%. Both materials can then be reused in the same printing process while losing very little of their performance viability. And because the nanocellulose is made from wood, it can simply be recycled along with the paper it was printed on.

Compared to a resistor or capacitor, a transistor is a relatively complex computer component used in devices such as power control or logic circuits and various sensors. Franklin explains that, by demonstrating a fully recyclable, multifunctional printed transistor first, he hopes to make a first step toward the technology being commercially pursued for simple devices. For example, Franklin says he could imagine the technology being used in a large building needing thousands of simple environmental sensors to monitor its energy use or customized biosensing patches for tracking medical conditions.

“Recyclable electronics like this aren’t going to go out and replace an entire half-trillion-dollar industry by any means, and we’re certainly nowhere near printing recyclable computer processors,” said Franklin. “But demonstrating these types of new materials and their functionality is hopefully a stepping stone in the right direction for a new type of electronics lifecycle.”

CITATION: “Printable and Recyclable Carbon Electronics Using Crystalline Nanocellulose,” Nicholas X. Williams, George Bullard, Nathaniel Brooke, Michael J Therien, Aaron D. Franklin. Nature Electronics, April 26, 2021. DOI: 10.1038/s41928-021-00574-0

Related

Source: Duke University

Recent Posts

Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
39
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
43
Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

1.10.2026
18
Antiferroelectric hafnia crystal structure showing alternating polar layers and field-aligned polar state, University of Nebraska–Lincoln

Antiferroelectric Hafnia at the 2D Limit

29.9.2026
36

On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

10.9.2026
52
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
39

Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design

16.6.2026
82

Imec Presents High-density MIMCAP RF interposer for III-V chiplets

15.6.2026
160

All‑Water Supercapacitor Based on 1‑nm Clay Channels and Nanoconfined Water Electrolyte

10.6.2026
116

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved