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    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

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    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    SCHURTER Introduces 2410 SMD Fuse for Robust AC/DC Protection

    TDK Releases High Temp 175C Automotive NTC thermistors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
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    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

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Researchers Introduced Screen-Printable Dielectrics for Foldable mmW and 5G Electronics

15.6.2022
Reading Time: 2 mins read
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A composite ink composed of ceramic particles dispersed in a polymer could make foldable electronics easier and cheaper to manufacture at the industrial scale. © 2021 KAUST; Hassan Tahini.

A composite ink composed of ceramic particles dispersed in a polymer could make foldable electronics easier and cheaper to manufacture at the industrial scale. © 2021 KAUST; Hassan Tahini.

Researchers at King Abdullah University of Science and Technology (KAUST) have developed a dielectric ink from the polymer ABS and ceramic particles. By screen-printing it onto glass, and then peeling off the dried result, flexible large-area dielectics of tunable thickness and permittivity can be made, as thin as a few microns and with a dielectric loss of 0.0063 at 28GHz.

A method that combines screen-printable composite and metallic inks could make foldable electronics easier and cheaper to manufacture at industrial scales. These devices, developed at KAUST, can be mounted on various supports, including nonplanar surfaces, and could enable many Internet of Things applications.

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Next-generation technology such as automotive radars for self-driving cars, smart buildings and wearable sensors will depend more heavily on the high-frequency millimeter-wave band, including 5G. To date, large-scale manufacturing approaches to make foldable electronics have focused on developing metallic inks and printing conductive patterns and have overlooked dielectric substrates.

There have been a range of barriers to the use of substrates such as paper and some polymer films in foldable electronics. These substrates involve fabrication processes that are too constraining and complex for mass production and cannot produce multilayered or ultrathin flexible devices. They also have a dielectric loss that exceeds the requirements for millimeter-wave devices.

Atif Shamim and coworkers have now devised a composite ink composed of ceramic particles dispersed in the polymer acrylonitrile-butadiene-styrene (ABS). They used this new ink to generate extremely flexible, large-area dielectric substrates with tunable lateral dimensions, thickness and permittivity. They screen-printed the ink on to glass and, after drying, simply peeled off the substrates from the support. The substrates presented a minimum thickness of a few microns that could be increased through successive printing passes. They also exhibited a low dielectric loss at 28 gigahertz, which is suitable for 5G antennas.

Related

Source: KAUST

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