Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    TDK Releases Ultra-small PFC Capacitors

    KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

    Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

    TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

    DigiKey Presents Factory Tomorrow Season 5 Video Series

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    TDK Releases Ultra-small PFC Capacitors

    KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

    Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

    TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

    DigiKey Presents Factory Tomorrow Season 5 Video Series

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers Introduced Screen-Printable Dielectrics for Foldable mmW and 5G Electronics

15.6.2022
Reading Time: 2 mins read
A A
A composite ink composed of ceramic particles dispersed in a polymer could make foldable electronics easier and cheaper to manufacture at the industrial scale. © 2021 KAUST; Hassan Tahini.

A composite ink composed of ceramic particles dispersed in a polymer could make foldable electronics easier and cheaper to manufacture at the industrial scale. © 2021 KAUST; Hassan Tahini.

Researchers at King Abdullah University of Science and Technology (KAUST) have developed a dielectric ink from the polymer ABS and ceramic particles. By screen-printing it onto glass, and then peeling off the dried result, flexible large-area dielectics of tunable thickness and permittivity can be made, as thin as a few microns and with a dielectric loss of 0.0063 at 28GHz.

A method that combines screen-printable composite and metallic inks could make foldable electronics easier and cheaper to manufacture at industrial scales. These devices, developed at KAUST, can be mounted on various supports, including nonplanar surfaces, and could enable many Internet of Things applications.

RelatedPosts

Electroninks Releases Gold and Platinum Particle-Free Conductive Inks

Peak Nano Installs Production Line for Innovative Capacitor Films

Electrical Properties Study of SMD Resistor Integrated Metallic Yarn for Smart Textiles

Next-generation technology such as automotive radars for self-driving cars, smart buildings and wearable sensors will depend more heavily on the high-frequency millimeter-wave band, including 5G. To date, large-scale manufacturing approaches to make foldable electronics have focused on developing metallic inks and printing conductive patterns and have overlooked dielectric substrates.

There have been a range of barriers to the use of substrates such as paper and some polymer films in foldable electronics. These substrates involve fabrication processes that are too constraining and complex for mass production and cannot produce multilayered or ultrathin flexible devices. They also have a dielectric loss that exceeds the requirements for millimeter-wave devices.

Atif Shamim and coworkers have now devised a composite ink composed of ceramic particles dispersed in the polymer acrylonitrile-butadiene-styrene (ABS). They used this new ink to generate extremely flexible, large-area dielectric substrates with tunable lateral dimensions, thickness and permittivity. They screen-printed the ink on to glass and, after drying, simply peeled off the substrates from the support. The substrates presented a minimum thickness of a few microns that could be increased through successive printing passes. They also exhibited a low dielectric loss at 28 gigahertz, which is suitable for 5G antennas.

Related

Source: KAUST

Recent Posts

TDK Releases Ultra-small PFC Capacitors

10.9.2025
7

KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

10.9.2025
8

Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

10.9.2025
4

TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

5.9.2025
16

Samsung MLCCs Lineup for In-Vehicle Infotainment

4.9.2025
27

Vishay Releases Harsh Environment Robust DC-Link Film Capacitor

2.9.2025
35

Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

29.8.2025
39

Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

28.8.2025
15

Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

28.8.2025
34

Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

27.8.2025
44

Upcoming Events

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version