Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Design Optimization for Power Electronics Applications

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Transformer Design Optimization for Power Electronics Applications

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Stabiliser Residue in Inks Inhibits Conductivity in 3D Printed Electronics

12.5.2021
Reading Time: 2 mins read
A A
(left) Digital inkjet printing of inks containing metal nanoparticles with in-situ solvent evaporation (pinning). (right) Optical and chemical images of a printed layer of silver nanoparticles showing organic residues at the surface; credit: University of Nottingham

(left) Digital inkjet printing of inks containing metal nanoparticles with in-situ solvent evaporation (pinning). (right) Optical and chemical images of a printed layer of silver nanoparticles showing organic residues at the surface; credit: University of Nottingham

Very thin layers of organic stabiliser residue in metal nanoparticle (MNP) inks are behind a loss of conductivity in 3D printed materials and electronic devices, according to the findings of a new study by the University of Nottingham and the National Physical Laboratory.

Inks containing metal nanoparticles are among the most commonly-used conductive materials for printed electronics. Ink-jetting layers of MNP materials allows for unpreceded design flexibility, rapid processing and 3D printing of functional electronic devices such as sensors, solar panels, LED displays, transistors and smart textiles.

RelatedPosts

Transformer Design Optimization for Power Electronics Applications

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

Inkjet 3D printing of metals typically form a solid printed object via a two-step process: solvent evaporation upon printing (pinning) and subsequent low-temperature consolidation of nanoparticles (sintering). The low temperature is important as in many applications the nanoparticles are co-printed with other functional/structural organic materials that are sensitive to higher temperatures.

However, layers produced by inkjet printing of metal nanoparticles have different electrical conductivity between horizontal and vertical directions. This effect is known as functional anisotropy and is a long-standing problem for the 3D printing of functional electronic devices, preventing its use for advanced applications.

It was previously thought that reduced vertical conductivity through a printed device is mainly caused by shape and physical continuity problems at the interfaces of the constituent nanoparticles (at the very small micro and nanoscale). However, Nottingham researchers used silver nanoparticles to show, for the first time, that it is caused by organic chemical residues in the inks.

These residues, which are added to the inks to help stabilise the nanomaterials, lead to the formation of low-conducting, very thin nanoscale layers which interfere with the electrical conductivity of the printed sample in the vertical direction.

With a clearer understanding of the distribution of residual organic additives within printed layers, the researchers hope to go on to define new techniques and develop new ink formulations to overcome functional anisotropy of inkjet-based 3D printed electronics.

Lead author, CfAM Research Fellow Dr Gustavo Trindade, said, “The conductivity of inkjet-printed metal nanoparticles is known to be dependent on processing temperature and have been previously attributed to changes in the shape and porosity of clustered nanoparticles, with the role of organic residues being only speculated.”

“This new insight enables the development of routes to overcome functional anisotropy in inkjet-based nanoparticles, and will therefore improve uptake of this potentially transformational technology, making it competitive with conventional manufacturing. Our approach is transferable to other nanomaterial-based inks including those containing graphene and functionalised nanocrystals, and will enable the development and exploitation of both 2D and 3D printed electronics like flexible and wearable sensors, solar panels, LED displays, transistors and smart textiles.” Dr Gustavo Trindade, research fellow at the Centre for Additive Manufacturing

Related

Source: University of Nottingham

Recent Posts

Lightweight Model for MLCC Appearance Defect Detection

3.11.2025
9

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
41

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
46
a Schematic diagram of the BNT-based components constructed based on the entropy-increase strategy. b Digital photograph, cross-sectional SEM image, and EDS mappings of the MLCCs. c Unipolar P-E loops of MLCCs as a function of applied E. d Wrec and η of the MLCCs as a function of applied E. The comparison of (e) Wrec and η, (f) η and UF of the MLCCs with those of other recently reported state-of-the-art MLCCs. source: Nature Communications

Researchers Proposed Enhanced Energy Storage MLCC

1.10.2025
27

Development of Nitrogen-Doped Graphene Supercapacitors 

30.9.2025
19

Textile-Based Antennas

29.9.2025
21

Researchers Developed Reduced Graphene Oxide (rGO) High Energy Density Graphene Supercapacitors

18.9.2025
41

Researchers Enhanced 2D Ferromagnets Performance

16.9.2025
9

Researchers Demonstrated HfO Anti-Ferroelectric Flexible Capacitors

19.8.2025
21

Additive Manufacturing of Mn-Zn Ferrite Planar Inductors

4.8.2025
46

Upcoming Events

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

Nov 11
17:00 - 18:00 CET

Industrial Applications Demand More from Interconnects in Next-Gen Designs

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version