Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Adds X8 Flexible-Termination Automotive MLCCs for 150°C Designs

    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

    Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

    Wk 32 Electronics Supply Chain Digest

    Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

    Advanced Electronics Markets Reshape Capacitor Demand for 2026/2027

    Panasonic Introduces Metallized Polypropylene Film Capacitors for Industrial and Automotive DC Applications

    Zowie Targets Embedded AI/HPC PDNs With Ultra-Thin Double-Sided MLPC Capacitors

    Modelithics CapV MVP Library: Measurement-Based Models for Varactor Chip Simulation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Video
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

    Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Adds X8 Flexible-Termination Automotive MLCCs for 150°C Designs

    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

    Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

    Wk 32 Electronics Supply Chain Digest

    Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

    Advanced Electronics Markets Reshape Capacitor Demand for 2026/2027

    Panasonic Introduces Metallized Polypropylene Film Capacitors for Industrial and Automotive DC Applications

    Zowie Targets Embedded AI/HPC PDNs With Ultra-Thin Double-Sided MLPC Capacitors

    Modelithics CapV MVP Library: Measurement-Based Models for Varactor Chip Simulation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Video
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

    Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Stabiliser Residue in Inks Inhibits Conductivity in 3D Printed Electronics

12.5.2021
Reading Time: 2 mins read
A A
(left) Digital inkjet printing of inks containing metal nanoparticles with in-situ solvent evaporation (pinning). (right) Optical and chemical images of a printed layer of silver nanoparticles showing organic residues at the surface; credit: University of Nottingham

(left) Digital inkjet printing of inks containing metal nanoparticles with in-situ solvent evaporation (pinning). (right) Optical and chemical images of a printed layer of silver nanoparticles showing organic residues at the surface; credit: University of Nottingham

Very thin layers of organic stabiliser residue in metal nanoparticle (MNP) inks are behind a loss of conductivity in 3D printed materials and electronic devices, according to the findings of a new study by the University of Nottingham and the National Physical Laboratory.

Inks containing metal nanoparticles are among the most commonly-used conductive materials for printed electronics. Ink-jetting layers of MNP materials allows for unpreceded design flexibility, rapid processing and 3D printing of functional electronic devices such as sensors, solar panels, LED displays, transistors and smart textiles.

RelatedPosts

YAGEO Adds X8 Flexible-Termination Automotive MLCCs for 150°C Designs

Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

Inkjet 3D printing of metals typically form a solid printed object via a two-step process: solvent evaporation upon printing (pinning) and subsequent low-temperature consolidation of nanoparticles (sintering). The low temperature is important as in many applications the nanoparticles are co-printed with other functional/structural organic materials that are sensitive to higher temperatures.

However, layers produced by inkjet printing of metal nanoparticles have different electrical conductivity between horizontal and vertical directions. This effect is known as functional anisotropy and is a long-standing problem for the 3D printing of functional electronic devices, preventing its use for advanced applications.

It was previously thought that reduced vertical conductivity through a printed device is mainly caused by shape and physical continuity problems at the interfaces of the constituent nanoparticles (at the very small micro and nanoscale). However, Nottingham researchers used silver nanoparticles to show, for the first time, that it is caused by organic chemical residues in the inks.

These residues, which are added to the inks to help stabilise the nanomaterials, lead to the formation of low-conducting, very thin nanoscale layers which interfere with the electrical conductivity of the printed sample in the vertical direction.

With a clearer understanding of the distribution of residual organic additives within printed layers, the researchers hope to go on to define new techniques and develop new ink formulations to overcome functional anisotropy of inkjet-based 3D printed electronics.

Lead author, CfAM Research Fellow Dr Gustavo Trindade, said, “The conductivity of inkjet-printed metal nanoparticles is known to be dependent on processing temperature and have been previously attributed to changes in the shape and porosity of clustered nanoparticles, with the role of organic residues being only speculated.”

“This new insight enables the development of routes to overcome functional anisotropy in inkjet-based nanoparticles, and will therefore improve uptake of this potentially transformational technology, making it competitive with conventional manufacturing. Our approach is transferable to other nanomaterial-based inks including those containing graphene and functionalised nanocrystals, and will enable the development and exploitation of both 2D and 3D printed electronics like flexible and wearable sensors, solar panels, LED displays, transistors and smart textiles.” Dr Gustavo Trindade, research fellow at the Centre for Additive Manufacturing

Related

Source: University of Nottingham

Recent Posts

Ultrahigh Energy Storage in Lead‑Free BiFeO₃‑Based Ceramic Capacitors via Local Polar Structure Design

16.6.2026
74

Imec Presents High-density MIMCAP RF interposer for III-V chiplets

15.6.2026
126

All‑Water Supercapacitor Based on 1‑nm Clay Channels and Nanoconfined Water Electrolyte

10.6.2026
107

Molecular Memristor Shows Record 145 kH Emergent Inductance

12.5.2026
81

Researchers Propose Next‑Gen Compact Memory Using Ultra-thin Ferroelectric Capacitors

11.5.2026
153

Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

7.5.2026
401

High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors

7.5.2026
208

Nanocrystalline Cores for Low‑Loss MHz Chip Inductors

25.3.2026
175
Schematic illustration of the electric double layer of porous carbon electrodes at elevated potentials in a a conventional electrolyte and b a weakly solvating electrolyte; source: authors

Researchers Presented Lignin-based Electrolyte for 4V Supercapacitors with Low Self‑Discharge

19.3.2026
82

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site