Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    June 2026 Interconnect, Passives and Electromechanical Components Market Insights

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    Wk 25 Electronics Supply Chain Digest

    Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

    Bourns Planar Transformers for SiC and GaN Gate Driver Isolation

    100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

    Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

    KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    June 2026 Interconnect, Passives and Electromechanical Components Market Insights

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    Wk 25 Electronics Supply Chain Digest

    Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

    Bourns Planar Transformers for SiC and GaN Gate Driver Isolation

    100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

    Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

    KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 12 Electronics Supply Chain Digest

23.3.2026
Reading Time: 4 mins read
A A


Electronics Supply Chain Weekly Digest 3-20-26.

DATAPOINT OF THE WEEK: This week, both onsemi and Alpha and Omega semiconductor announced price icreases effective April 1 on select products, each citing rising raw material, energy, and infrastructure costs as the driver. onsemi and AOS join other suppliers such as Infineon, NXP, ADI, and TI to raise price in recent months.

RelatedPosts

June 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 25 Electronics Supply Chain Digest

Wk 24 Electronics Supply Chain Digest

A growing concern for input costs is the sharp declines in Helium production as a result of the war in Iran. QatarEnergy has yet to restart helium production at its Ras Laffan complex following drone strikes on March 2 that knocked out roughly 30% of global supply, a meaningful concern for chipmakers dependent on helium for EUV lithography cooling, according to TrendForce.

Headlines:

Auto/Transportation

  • Global EV traction inverter installations hit 9.65M units in 4Q25, highest in nearly two years, as 800V adoption surges, according to TrendForce
  • GM CFO says gas price hikes not impacting sales, with 1Q more affected by weather and low truck inventory
  • US EV market sees new sales drop 26.8% Y/Y in February as used EV demand rises 28.8% Y/Y, according to Cox
  • US new-vehicle affordability improves in February, with median weeks of income needed falling to 35.4, according to Cox
  • Volkswagen signals shift toward Chinese chips amid growing tension with Nvidia’s automotive platforms, according to DigiTimes
  • Xpeng 1Q revenue guidance of $1.77B-$1.93B , below expectations as EV demand slump drives 40% Y/Y delivery drop in Jan-Feb
  • XPeng targets double overseas sales in 2025, launching models in Mexico and eyes 70% of profit from international markets by 2030

Datacenter

  • Nebius announces it has signed $27B AI infrastructure deal with Meta, including $12B committed capacity by 2027

IP&E

  • MuRata plans to decouple China rare earth supply chain over next 3 years amid rising geopolitical risk, according to Financial Times
  • Nvidia charts optical-copper dual-track path for AI data centers, with CPO expected to hit 35% penetration by 2030, according to DigiTimes

Semiconductors

  • Analog Devices opens new Thailand facility adding wafer-level processing, chip-scale packaging and final testing capacity
  • Horizon Robotics’ next-gen Journey 7 chip to outpace Nvidia’s Thor-X, targeting mass production in 2027, according to LatePost
  • Huali Microelectronics readies 7nm chip production in Shanghai with Huawei collaboration, as reported by Reuters
  • Infineon VP calls on Europe to scale up 300mm wafer fabs and automate to counter Chinese competition, according to Reuters
  • Micron reports massive F2Q beat, guides sharply higher on surging DRAM and NAND prices and raises capex to $25B+
  • Nvidia restarts H20 chip manufacturing for China after receiving US export licenses, excludes sales from $1T forecast
  • Nvidia preparing China-compatible Groq inference chips ahead of May availability, Reuters reported
  • Nvidia to sell 1M GPUs plus networking and inference chips to AWS by end of 2027
  • Nvidia partners with Infineon, NXP, and STMicroelectronics to supply hardware for humanoid robots, says TrendForce
  • onsemi to raise prices on select products from April 1 citing elevated input and manufacturing costs
  • Samsung Electronics to begin volume production of Tesla chips at Texas factory in 2H27
  • Samsung faces 18-day strike threat from May 21 as workers demand 7% wage hike and profit-based bonuses, per Reuters
  • Samsung to supply up to 800M GB of next-gen HBM4 chips to OpenAI for its first in-house AI processor, according to Korean Economic Daily
  • Samsung and AMD sign MoU to expand HBM4 and DDR5 memory supply for next-gen AI accelerators and EPYC processors
  • Vanguard International Semiconductor to raise foundry prices ~10% in April 2026, citing rising input costs
  • Tiancheng Semiconductor develops 14-inch SiC single crystal, marking China’s first step toward 14-inch commercialization

Consumer/Other

  • Amazon reportedly developing new AI-native smartphone codenamed “Transformer,” a decade after $170M Fire Phone flop, says Reuters

Related

Source: Edgewater Research

Recent Posts

Wk 25 Electronics Supply Chain Digest

29.6.2026
15

Wk 24 Electronics Supply Chain Digest

15.6.2026
63

Wk 23 Electronics Supply Chain Digest

8.6.2026
72

Wk 22 Electronics Supply Chain Digest

1.6.2026
60

Wk 19 Electronics Supply Chain Digest

11.5.2026
115

Wk 18 Electronics Supply Chain Digest

4.5.2026
98

Wk 17 Electronics Supply Chain Digest

27.4.2026
51

Wk 16 Electronics Supply Chain Digest

20.4.2026
52

Wk 15 Electronics Supply Chain Digest

13.4.2026
50

Upcoming Events

Jun 30
17:00 - 18:00 CEST

PSMA Capacitor Committee Webinar: High Voltage Pulse Capacitors

Jul 2
17:30 - 18:30 CEST

Can Claude design a production-ready Custom Magnetic Component?

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version