Electronics Supply Chain Weekly Digest 6-26-26.
DATAPOINT OF THE WEEK: May new car registrations in Europe totaled 1.15M, surpassing the 1M mark for third straight month. Registrations increased 3.5% Y/Y and held steady M/M, according to ACEA data.
BEVs maintained strong growth in May, reaching 255k registrations, up 38.7% Y/Y and were up 5.1% M/M, accounting for 23.3% of the market in May, up 5.9 percentage points Y/Y. PHEVs also saw significant Y/Y growth, rising 14%. HEVs increased 7.9% Y/Y but fell 2.5% M/M.
HEVs now account for 35.5% of the market, up 1.4 percentage points Y/Y. ICE registrations declined 18.6% Y/Y and 2% M/M in May, marking its 25th straight month of Y/Y declines.
Headlines:
Auto/Transportation
- Automakers warn California sales could halt July 1; say in-vehicle tracking-protection rules can’t be engineered in time
- Stellantis, Nissan in talks to take over Marelli assets as part of broader rescue of bankrupt supplier, according to Bloomberg
- Polestar pulls out of US market from 2027 model year after US Commerce Department denies Connected Vehicles Rule authorization
- Tesla to lift Berlin plant output 20% to 7.5K vehicles per week in October on Model Y demand
- VW weighs four plant closures, up to 100k job cuts in largest-ever auto restructuring, according to Reuters
Datacenter
- Amazon to invest additional $13B in India by 2030, lifting AI and cloud commitment past $21B
Connectivity
- Corning reportedly evaluating South Korea manufacturing base for semiconductor glass substrates, extending AI play into advanced packaging, says Digitimes
Industrial
- Anduril reportedly in talks to acquire Nissan’s Oppama plant in Japan to build military drones, per Reuters
Semiconductors
- Innoscience clears German legal path for current GaN power devices as Munich court limits Infineon patent ruling to discontinued products
- MediaTek notifies customers of 10–20% chip price hikes; reportedly wins Google TPU v9 SerDes orders over Broadcom, TechNews reported
- Micron tops C2Q expectations on surging DRAM/NAND pricing and guides well above expectations with SCAs covering $100B+
- Micron announced memory and storage supply deal with Anthropic
- Nvidia’s 800V HVDC Power Rack to ship in 3Q26 as optional Vera Rubin config, with broader adoption awaiting Rubin Ultra in 2H27, according to TrendForce
- onsemi rolls out GaNEXUS GaN portfolio spanning 40V to 650V to target AI datacenter power delivery and 48V IBC
- onsemi to acquire Synaptics for $7B, extending power and sensing franchise into edge AI compute
- OpenAI unveils first custom inference chip, Jalapeño, co-designed with Broadcom, targeting deployment by year-end
- Qualcomm unveils HBC near-memory compute architecture, claiming 6x bandwidth-per-watt vs HBM and bypassing costly silicon interposers
- Samsung to reportedly pledge $648B over 10 years across chips, AI datacenters, batteries, and displays in South Korea
- STMicroelectronics readies second MCU price hike of the year for June 28 as foundry pass-throughs ripple across the supply chain, per ijiwei
- TSMC accelerates advanced-node pivot by slashing 28nm output over 25% since early 2026, according to Commercial Times
Consumer
- Apple hikes MacBook and iPad prices as AI-driven memory shortage breaks its supply chain shield
- Meta and EssilorLuxottica announce entry AI smart glasses at $299
