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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

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    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

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    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

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    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

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    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

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Bourns Releases Low Profile Automotive LAN Transformer

5.1.2022
Reading Time: 2 mins read
A A

Advanced features make Model SM453229A-381N7Y 10/100/1000 Base-T Chip LAN Transformer ideal for EMI suppression and Ethernet-based applications.

Bourns Magnetics Product Line is introducing the new Model SM453230-121N7YP Gigabit Ethernet / PoE+ Chip LAN 1G/2.5G/5G and Model SM453230-231N7YP Gigabit Ethernet / PoE+ Chip-LAN 10G Base-T Transformers.

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Unlike traditional LAN magnetics built with multiple toroidal core transformers and common mode chokes in a single module, the chip-LAN transformer is a discrete, center-tapped component wound on a drum core and capped with a ferrite plate to emulate the result of the close magnetic path of a toroid core. A common mode chip inductor is paired with a chip-LAN transformer to provide EMI suppression. The discrete transformer / common mode chip inductor arrangement offers a high degree of flexibility in a PCB layout.

The Model SM453230-121N7YP and Model SM453230-231N7YP Gigabit Ethernet Chip-LAN Transformers are IEEE 802.3 Ethernet compatible and PoE+ (700 mA) capable, with an expanded operating temperature range of -40 to +85 °C. They are ideal for use in LAN interfaces for a variety of high-speed telecommunication and network devices.

Features

  • IEEE 802.3 ethernet compatible
  • Compatible with 1G/2.5G/5G/10G Base-T
  • PoE+ capable
  • Discrete transformers and common mode chip inductors for flexible PCB layout
  • Pairing common mode chip inductors for EMI reduction
  • Expanded temperature range: -40 to +85 °C
  • RoHS compliant and halogen free

Applications

  • High speed telecommunication and network devices

Related

Source: Bourns

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