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inter-connect news
Earthing Systems and IEC Classification Explained
Earthing (grounding) systems are a fundamental part of low‑voltage electrical installations, directly influencing fault current paths, touch voltages and the...
Read moreDetailsSmiths Interconnect invests £2m in Costa Rica electronics plant
Smiths Interconnect has announced an investment of over £2 million in its manufacturing facility in Costa Rica to support the...
Read moreDetailsWürth Elektronik Introduces Lead-Free SMT Spacers
Würth Elektronik has reworked its SMT spacer portfolio to use lead‑free alloys and added new assembly options targeted at high‑volume...
Read moreDetailsTop 10 Connector Vendors by Product Type
Bishop & Associates, a leading market research firm specializing in the electronic connector industry, presents in its TTI MarketEye article...
Read moreDetailsBinder Unveils M8 Flange Solder Connectors for Flexible Cabling
Binder has expanded its M8 circular connector portfolio with new flange connectors that use solder bucket terminations instead of pre‑molded...
Read moreDetailsCoaxial Connectors and How to Connect with PCB
This article based on Würth Elektronik webinar presentation discusses in-depth optimizing RF signal integrity for coaxial connectors and coaxial-to-PCB interconnect....
Read moreDetailsPCB Manufacturing, Test Methods, Quality and Reliability
This article based on Würth Elektronik webinar by Andreas Dreher explains PCN Test Methods and how to inspect Quality and...
Read moreDetailsMolex Introduces Modular Wire-to-Wire Automotive Connectors
Molex introduces MX-DaSH Modular Wire-to-Wire Connectors, combining power and signal terminals in a single, modular system to reduce wiring harness...
Read moreDetailsMurata Releases World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate
Murata Manufacturing Co., Ltd announces the World’s First LCP (liquid crystal polymer) flexible substrate with an Inner Cavity structure, ULTICIRC,...
Read moreDetailsKey Interconnect Technologies for 2025
This article provides technical insights into four innovations shaping next‑generation high‑speed systems that was presented by Samtec in its blog....
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