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    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

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    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    Trending Tags

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Chilisin is Increasing Capacity to Meet High Inductor Demand for Notebooks and 5G Smartphones

6.10.2020
Reading Time: 2 mins read
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Taiwan based Chilisin Electronics has seen clear order visibility for its inductor-related product lines through the end of 2020 and even early 2021, thanks to strong demand for notebook, handset and gaming applications, according to company sources.

Chilisin said persistent demand for Chromebooks and gaming notebooks, the launch of new game consoles by Sony and Microsoft later in the year and robust pull-in momentum from handset vendors in China and South Korea have combined to promise a bright fourth-quarter for its shipments.

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The company disclosed that demand for 5G handset-use passive components has shot up 300%, with its shipments of small-size, high-margin molding chokes and LTCC (low temperature co-fired ceramic) components to hit record highs in the fourth quarter, significantly driving up its revenues.

To meet the demand, Chilisin has stepped up capacity expansions, having boosted, ahead of schedule, its monthly capacity to 600 million units for small-size molding chokes and 300 million units for large-size ones. It is also moving to double monthly capacity to 200 million units for LTCC components.

Chilisin and local peers Inpaq Technology and Arlitech Electronic may see their shipments to China slip slightly due to the country’s long national holidays in October, but their shipments for the months ahead are expected to ramp up significantly, industry sources said, adding that Chinese clients are likely to raise their inventories for passive components as well as for power management ICs, LCD driver ICs, acoustic and other peripheral chips following US trade sanctions on SMIC.

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Source: DigiTimes

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