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    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

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    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

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    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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Chilisin is Increasing Capacity to Meet High Inductor Demand for Notebooks and 5G Smartphones

6.10.2020
Reading Time: 2 mins read
A A

Taiwan based Chilisin Electronics has seen clear order visibility for its inductor-related product lines through the end of 2020 and even early 2021, thanks to strong demand for notebook, handset and gaming applications, according to company sources.

Chilisin said persistent demand for Chromebooks and gaming notebooks, the launch of new game consoles by Sony and Microsoft later in the year and robust pull-in momentum from handset vendors in China and South Korea have combined to promise a bright fourth-quarter for its shipments.

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The company disclosed that demand for 5G handset-use passive components has shot up 300%, with its shipments of small-size, high-margin molding chokes and LTCC (low temperature co-fired ceramic) components to hit record highs in the fourth quarter, significantly driving up its revenues.

To meet the demand, Chilisin has stepped up capacity expansions, having boosted, ahead of schedule, its monthly capacity to 600 million units for small-size molding chokes and 300 million units for large-size ones. It is also moving to double monthly capacity to 200 million units for LTCC components.

Chilisin and local peers Inpaq Technology and Arlitech Electronic may see their shipments to China slip slightly due to the country’s long national holidays in October, but their shipments for the months ahead are expected to ramp up significantly, industry sources said, adding that Chinese clients are likely to raise their inventories for passive components as well as for power management ICs, LCD driver ICs, acoustic and other peripheral chips following US trade sanctions on SMIC.

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Source: DigiTimes

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