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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

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    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

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    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

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    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

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    Bourns Adds ACXX57SQ Air Coil Inductors for RF Design

    Samsung Electro-Mechanics MLCC capacitor solutions for high-voltage converter snubbing and GPU power delivery

    Samsung MLCC Options for 1 MW AI Rack Power

    Frenetic planar ER transformer simulation for a 5 kW 800 V-to-50 V PSFB converter, showing low-profile core geometry and high-current planar winding arrangement

    5 kW 800 V-to-50 V PSFB Transformer Design for Data Centers

    Samtec 100-CM 1.0 mm vertical solderless compression-mount 50 ohm RF PCB connector

    Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

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Ethernet & Modular Jacks

20.9.2021
Reading Time: 2 mins read
A A

Today, modular jack connectors and Ethernet protocols can be found in most consumer and industrial applications, among others. There are so many options that it becomes difficult to choose the right one.


This section aims to give a brief overview of the Modular Jack connectors technology and Ethernet protocols in order to get a better understanding of potential applications, and to help design engineers to choose the right connector for their application.

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Ethernet History
Ethernet comes from the word Ether, a hypothetical medium to propagate electromagnetic waves according to scientific concepts of the 18th and 19th centuries. This protocol was first used at the University of Hawaii in the early 1970s in order to facilitate the communication between the various campuses on the island. It was based on a radio protocol Aloha (Hello).

At that time, manufacturers had all developed their own communication protocols (SNA for IBM, DECnet for DEC, DSA for Bull, etc.). It rapidly became clear that it would be impossible to interconnect these systems without creating an international standard.

In 1977, the International Standards Organization (ISO) created a complete set of recommendations regarding compatibility requirements; the aim was to enable the connection between open systems, i.e. systems using the same protocols, in order to exchange data.

The initial results obtained with Ethernet in 1980 drove XEROX, Intel and Digital to join their forces to develop this network and to put an end to all private protocols.

In 1984, ISO published an update of their recommendations under the name:

Reference OSI (Open Systems Interconnection). Detailed information about the OSI Model you will find in our design guide Trilogy of Magnetics. This update has become an international standard and serves as a guide. In 1985, the IEEE finalized the standard 802.3 regarding Ethernet.

The adventure could begin …

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Source: Wurth elektronik

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