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    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

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    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

    Vishay Releases Harsh Environment Robust DC-Link Film Capacitor

    Bourns Releases Automotive High Creepage and Clearance Transformer

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

    Samtec Releases 800-Position High-Performance Array Connectors  

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

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    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

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High Density Interconnect Support PCB Miniaturization

11.8.2025
Reading Time: 1 min read
A A

This Würth Elektronik webinar explains miniaturization for industrial electronics, taking cost and reliability aspects into account utilizing High Density Interconnect (HDI) solutions.

Smaller, more powerful, more adaptable: with High Density Interconnect (HDI) you can manage the balancing act between miniaturisation, costs and reliability. In the miniaturisation of PCBs, microvias in the “via in pad” design play a decisive role in unbundling increasingly dense BGA components.

RelatedPosts

SEPIC Converter with Coupled and Uncoupled Inductors

Würth Elektronik Releases Push-Button and Main Switches

Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

In this webinar we will show you:

  • Miniaturization options for rigid PCBs
  • Different via designs
  • Design rules for High Density Interconnect
  • Layer structures & cost development
  • Signal integrity with HDI
  • Reliability aspects and heat dissipation with HDI

Related

Source: Würth Elektronik

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