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    Advances in the Environmental Performance of Polymer Capacitors

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    Connector PCB Design Challenges

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    Advances in the Environmental Performance of Polymer Capacitors

    Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

    Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

    Paumanok Releases Capacitor Foils Market Report 2025-2030

    Modelithics Welcomes CapV as a Sponsoring MVP

    Wk 40 Electronics Supply Chain Digest

    Benefits of Tantalum Powder Stress–Strain Curve Evaluation vs Conventional Wet Test

    Electrolyte Selection and Performance in Supercapacitors

    Connector PCB Design Challenges

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
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    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

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High Density Interconnect Support PCB Miniaturization

11.8.2025
Reading Time: 1 min read
A A

This Würth Elektronik webinar explains miniaturization for industrial electronics, taking cost and reliability aspects into account utilizing High Density Interconnect (HDI) solutions.

Smaller, more powerful, more adaptable: with High Density Interconnect (HDI) you can manage the balancing act between miniaturisation, costs and reliability. In the miniaturisation of PCBs, microvias in the “via in pad” design play a decisive role in unbundling increasingly dense BGA components.

RelatedPosts

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Different Causes of Capacitor Degradation and Failure Mechanisms

Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

In this webinar we will show you:

  • Miniaturization options for rigid PCBs
  • Different via designs
  • Design rules for High Density Interconnect
  • Layer structures & cost development
  • Signal integrity with HDI
  • Reliability aspects and heat dissipation with HDI

Related

Source: Würth Elektronik

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