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    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

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    Coupled Inductors in SEPIC versus Flyback Converters

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High Density Interconnect Support PCB Miniaturization

11.8.2025
Reading Time: 1 min read
A A

This Würth Elektronik webinar explains miniaturization for industrial electronics, taking cost and reliability aspects into account utilizing High Density Interconnect (HDI) solutions.

Smaller, more powerful, more adaptable: with High Density Interconnect (HDI) you can manage the balancing act between miniaturisation, costs and reliability. In the miniaturisation of PCBs, microvias in the “via in pad” design play a decisive role in unbundling increasingly dense BGA components.

RelatedPosts

Power Inductors Future: Minimal Losses and Compact Designs

Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

Connector PCB Design Challenges

In this webinar we will show you:

  • Miniaturization options for rigid PCBs
  • Different via designs
  • Design rules for High Density Interconnect
  • Layer structures & cost development
  • Signal integrity with HDI
  • Reliability aspects and heat dissipation with HDI

Related

Source: Würth Elektronik

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