Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Vishay Releases Industry First Automotive SMD Y1 Safety Ceramic Capacitors

    Researchers Enhanced 2D Ferromagnets Performance

    Bourns Releases Two High Current Common Mode Choke Models

    Electronics Weekly Announcing Finalists for Elektra Awards 2025

    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

    Panasonic Industry to Double Production of MEGTRON PCB Materials

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Vishay Releases Industry First Automotive SMD Y1 Safety Ceramic Capacitors

    Researchers Enhanced 2D Ferromagnets Performance

    Bourns Releases Two High Current Common Mode Choke Models

    Electronics Weekly Announcing Finalists for Elektra Awards 2025

    Exxelia Exhibit at Electronica India September 17–19, 2025

    Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

    VINATech Unveils Hybrid Energy Storage System to Revolutionize Grid Stability and Power Delivery

    SCHURTER Releases High Performance EV-Fuse

    Panasonic Industry to Double Production of MEGTRON PCB Materials

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

High Density Interconnect Support PCB Miniaturization

11.8.2025
Reading Time: 1 min read
A A

This Würth Elektronik webinar explains miniaturization for industrial electronics, taking cost and reliability aspects into account utilizing High Density Interconnect (HDI) solutions.

Smaller, more powerful, more adaptable: with High Density Interconnect (HDI) you can manage the balancing act between miniaturisation, costs and reliability. In the miniaturisation of PCBs, microvias in the “via in pad” design play a decisive role in unbundling increasingly dense BGA components.

RelatedPosts

Würth Elektronik Announces 2025 Digital WE Days Virtual Conference

Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

SEPIC Converter with Coupled and Uncoupled Inductors

In this webinar we will show you:

  • Miniaturization options for rigid PCBs
  • Different via designs
  • Design rules for High Density Interconnect
  • Layer structures & cost development
  • Signal integrity with HDI
  • Reliability aspects and heat dissipation with HDI

Related

Source: Würth Elektronik

Recent Posts

Panasonic Industry to Double Production of MEGTRON PCB Materials

15.9.2025
4

Glass Core Technology Breakthrough Potential for High-Speed Interconnects

12.6.2025
50

What Track Width To Use When Routing PCB

6.6.2025
61

Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

15.5.2025
49

High-Density PCB Assemblies For Space Applications

2.5.2025
52

IPC Class 2 vs Class 3 Solder Joints Requirements Explained

27.2.2025
515

HIROSE Expands Open Pluggable OPS PCB connector

9.1.2025
52

How to Determine Chip Temperature

3.1.2025
220

Die and Wire PCB Bonding Explained

1.7.2025
159

EMI Shielding Challenges

1.7.2025
15

Upcoming Events

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version