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    Vishay Releases Miniature SMD Trimmers for Harsh Environments

    Würth Elektronik Releases Push-Button and Main Switches

    Littelfuse Unveils High-Precision TMR Angle Magnetic Sensors

    Stackpole Extends Voltage of High Temp Chip Resistors

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    KYOCERA AVX Releases Hermaphroditic WTW and WTB Connectors

    Radiation Tolerance of Tantalum and Ceramic Capacitors

    TDK Releases Compact Polypropylene Film Capacitors for Resonant Topologies

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    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

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    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

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    Vishay Releases Miniature SMD Trimmers for Harsh Environments

    Würth Elektronik Releases Push-Button and Main Switches

    Littelfuse Unveils High-Precision TMR Angle Magnetic Sensors

    Stackpole Extends Voltage of High Temp Chip Resistors

    High Voltage MLCCs Meeting the Growing Demand for Efficiency in Power Conversion

    Bourns Releases High Power High Ripple Chokes

    KYOCERA AVX Releases Hermaphroditic WTW and WTB Connectors

    Radiation Tolerance of Tantalum and Ceramic Capacitors

    TDK Releases Compact Polypropylene Film Capacitors for Resonant Topologies

    Trending Tags

    • Ripple Current
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    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

    Understanding Switched Capacitor Converters

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

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NVIDIA GB300 Boost Hybrid Supercapacitor Demand

26.3.2025
Reading Time: 2 mins read
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NVIDIA unveiled its latest GB300 server, which is slated for launch in the second half of 2025. A notable feature of this server is its integration of a supercapacitor into its power system design.

The built-in supercapacitor in NVIDIA’s GB300 is primarily designed to provide a stable power supply environment required by AI and cloud computing servers.

RelatedPosts

Vishay Releases Miniature SMD Trimmers for Harsh Environments

Würth Elektronik Releases Push-Button and Main Switches

Littelfuse Unveils High-Precision TMR Angle Magnetic Sensors

The high-power capacitor module incorporates lithium-ion supercapacitors (LIC), which provide high power density and extended duration support, along with rapid charging and discharging capabilities.

Manufacturers in the United States, Japan, and South Korea are actively expanding into the supercapacitor market. Taiwanese companies are also striving to enter NVIDIA’s GB300 power system and supercapacitor supply chain. For instance, Delta Electronics unveiled a rack-mounted high-power capacitor module for AI and high-performance computing data centers at GTC, which also incorporates built-in lithium-ion capacitors. LITEON Technology also announced at GTC its collaboration with NVIDIA on the development of next-generation power supplies.

NVIDIA is anticipated to launch the GB300 chip ahead of schedule in the second quarter of 2025. Recent supply chain developments suggest that GB300-related suppliers are set to commence design planning in the second quarter of 2025.

The GB300 chip and Compute Tray are expected to enter production by May, with Original Design Manufacturers (ODMs) designing early engineering samples. By the third quarter of 2025, as rack system configurations, power specifications, and SOCAMM designs are finalized and transition into mass production, GB300 full-rack systems are anticipated to gradually increase shipments.

Related

Source: NVIDIA

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