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    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

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    Coilcraft Releases Automotive Common Mode Chokes

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    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

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    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

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NVIDIA GB300 Boost Hybrid Supercapacitor Demand

26.3.2025
Reading Time: 2 mins read
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NVIDIA unveiled its latest GB300 server, which is slated for launch in the second half of 2025. A notable feature of this server is its integration of a supercapacitor into its power system design.

The built-in supercapacitor in NVIDIA’s GB300 is primarily designed to provide a stable power supply environment required by AI and cloud computing servers.

RelatedPosts

Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

The high-power capacitor module incorporates lithium-ion supercapacitors (LIC), which provide high power density and extended duration support, along with rapid charging and discharging capabilities.

Manufacturers in the United States, Japan, and South Korea are actively expanding into the supercapacitor market. Taiwanese companies are also striving to enter NVIDIA’s GB300 power system and supercapacitor supply chain. For instance, Delta Electronics unveiled a rack-mounted high-power capacitor module for AI and high-performance computing data centers at GTC, which also incorporates built-in lithium-ion capacitors. LITEON Technology also announced at GTC its collaboration with NVIDIA on the development of next-generation power supplies.

NVIDIA is anticipated to launch the GB300 chip ahead of schedule in the second quarter of 2025. Recent supply chain developments suggest that GB300-related suppliers are set to commence design planning in the second quarter of 2025.

The GB300 chip and Compute Tray are expected to enter production by May, with Original Design Manufacturers (ODMs) designing early engineering samples. By the third quarter of 2025, as rack system configurations, power specifications, and SOCAMM designs are finalized and transition into mass production, GB300 full-rack systems are anticipated to gradually increase shipments.

Related

Source: NVIDIA

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