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    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

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    Elektra Awards 2026: Passive Components and Interconnect Finalists Showcase Advances in Power Integrity, Precision and Reliability

    Mathematical state-space illustration of a series-connected memcapacitor oscillator with two constrained memory coordinates

    Memcapacitor chaos in a six-state series-connected model

    Exxelia capacitor and magnetics innovations for Electronica 2026, including CM-HVLP and CF-PP140 capacitors

    Exxelia Brings High-Temperature Passives to Electronica 2026

    IP&E Market Outlook: AI Demand Tightens Supply and Supports Higher Pricing into 2027

    Samsung Electro-Mechanics CL05Z106MS66PN automotive MLCC illustration with a rectangular ceramic body and metal end terminations

    Samsung Adds 0402 10 µF X7T MLCC for ADAS Power Rails

    Bourns PTVS03-450E-H power TVS diode in a surface-mount DFN package

    Bourns Releases 450 V Power TVS for DC Bus Clamping

    MLCC construction image

    Samsung Electro-Mechanics Patent Targets to Reduce Moisture and Cracks in High-Capacity MLCCs

    Samsung Electro-Mechanics MFC molded frame ceramic capacitor with epoxy encapsulation and external metal frame

    Samsung 100V Molded Frame MLCC Targets 48V AI Server PSUs

    SCHURTER EKO square-body DC fuse variants with ceramic bodies and different metal terminal arrangements

    SCHURTER EKO DC Fuses Extend to 1500 V and 2000 A

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NVIDIA GB300 Boost Hybrid Supercapacitor Demand

26.3.2025
Reading Time: 2 mins read
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NVIDIA unveiled its latest GB300 server, which is slated for launch in the second half of 2025. A notable feature of this server is its integration of a supercapacitor into its power system design.

The built-in supercapacitor in NVIDIA’s GB300 is primarily designed to provide a stable power supply environment required by AI and cloud computing servers.

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Memcapacitor chaos in a six-state series-connected model

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The high-power capacitor module incorporates lithium-ion supercapacitors (LIC), which provide high power density and extended duration support, along with rapid charging and discharging capabilities.

Manufacturers in the United States, Japan, and South Korea are actively expanding into the supercapacitor market. Taiwanese companies are also striving to enter NVIDIA’s GB300 power system and supercapacitor supply chain. For instance, Delta Electronics unveiled a rack-mounted high-power capacitor module for AI and high-performance computing data centers at GTC, which also incorporates built-in lithium-ion capacitors. LITEON Technology also announced at GTC its collaboration with NVIDIA on the development of next-generation power supplies.

NVIDIA is anticipated to launch the GB300 chip ahead of schedule in the second quarter of 2025. Recent supply chain developments suggest that GB300-related suppliers are set to commence design planning in the second quarter of 2025.

The GB300 chip and Compute Tray are expected to enter production by May, with Original Design Manufacturers (ODMs) designing early engineering samples. By the third quarter of 2025, as rack system configurations, power specifications, and SOCAMM designs are finalized and transition into mass production, GB300 full-rack systems are anticipated to gradually increase shipments.

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Source: NVIDIA

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