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    Filter Capacitors in Electric Vehicles: Knowles Safety MLCCs for BMS and Isolated DC/DC Converters

    YAGEO Expands Aluminum Polymer Capacitors for High-Temperature AI Server Power Rails

    Modelithics COMPLETE v26.4 Expands RF Passive Models for Keysight ADS

    Vishay IFBT SMT Flyback Transformers Target PoE and Isolated DC/DC Designs up to 30 W

    Bourns Automotive BMS Signal Transformer Combines Reinforced Isolation and Common-Mode Noise Rejection

    Murata Launches 100V 10 µF Lead-Type MLCCs for 48V Systems

    Bourns Extends Current Sense Resistors for High-Current Power Designs with 0.1 mΩ, 15 W

    KYOCERA AVX Releases Vibration-Proof SMD Aluminum Electrolytic Capacitors for Harsh Industrial Designs

    Vishay Introduces Automotive Low Loss SMD Common-Mode Chokes

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NVIDIA GB300 Boost Hybrid Supercapacitor Demand

26.3.2025
Reading Time: 2 mins read
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NVIDIA unveiled its latest GB300 server, which is slated for launch in the second half of 2025. A notable feature of this server is its integration of a supercapacitor into its power system design.

The built-in supercapacitor in NVIDIA’s GB300 is primarily designed to provide a stable power supply environment required by AI and cloud computing servers.

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The high-power capacitor module incorporates lithium-ion supercapacitors (LIC), which provide high power density and extended duration support, along with rapid charging and discharging capabilities.

Manufacturers in the United States, Japan, and South Korea are actively expanding into the supercapacitor market. Taiwanese companies are also striving to enter NVIDIA’s GB300 power system and supercapacitor supply chain. For instance, Delta Electronics unveiled a rack-mounted high-power capacitor module for AI and high-performance computing data centers at GTC, which also incorporates built-in lithium-ion capacitors. LITEON Technology also announced at GTC its collaboration with NVIDIA on the development of next-generation power supplies.

NVIDIA is anticipated to launch the GB300 chip ahead of schedule in the second quarter of 2025. Recent supply chain developments suggest that GB300-related suppliers are set to commence design planning in the second quarter of 2025.

The GB300 chip and Compute Tray are expected to enter production by May, with Original Design Manufacturers (ODMs) designing early engineering samples. By the third quarter of 2025, as rack system configurations, power specifications, and SOCAMM designs are finalized and transition into mass production, GB300 full-rack systems are anticipated to gradually increase shipments.

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Source: NVIDIA

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