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    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

    B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

    Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

    Connector Industry Performance Accelerates Through Mid-2026

    Wk 33 Electronics Supply Chain Digest

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NVIDIA GB300 Boost Hybrid Supercapacitor Demand

26.3.2025
Reading Time: 2 mins read
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NVIDIA unveiled its latest GB300 server, which is slated for launch in the second half of 2025. A notable feature of this server is its integration of a supercapacitor into its power system design.

The built-in supercapacitor in NVIDIA’s GB300 is primarily designed to provide a stable power supply environment required by AI and cloud computing servers.

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Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

The high-power capacitor module incorporates lithium-ion supercapacitors (LIC), which provide high power density and extended duration support, along with rapid charging and discharging capabilities.

Manufacturers in the United States, Japan, and South Korea are actively expanding into the supercapacitor market. Taiwanese companies are also striving to enter NVIDIA’s GB300 power system and supercapacitor supply chain. For instance, Delta Electronics unveiled a rack-mounted high-power capacitor module for AI and high-performance computing data centers at GTC, which also incorporates built-in lithium-ion capacitors. LITEON Technology also announced at GTC its collaboration with NVIDIA on the development of next-generation power supplies.

NVIDIA is anticipated to launch the GB300 chip ahead of schedule in the second quarter of 2025. Recent supply chain developments suggest that GB300-related suppliers are set to commence design planning in the second quarter of 2025.

The GB300 chip and Compute Tray are expected to enter production by May, with Original Design Manufacturers (ODMs) designing early engineering samples. By the third quarter of 2025, as rack system configurations, power specifications, and SOCAMM designs are finalized and transition into mass production, GB300 full-rack systems are anticipated to gradually increase shipments.

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Source: NVIDIA

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