Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

ECIA Industry Pulse Moderates as Passive Lead Times Tighten

10.9.2026
Reading Time: 5 mins read
A A
ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

ECIA’s August and Q3 2026 Industry Pulse shows that electronics-component market sentiment is cooling from its June peak, but remains firmly in expansion territory.

Passive components continue to show positive sales expectations, while broadening lead-time pressure makes closer supply-chain monitoring increasingly important.

RelatedPosts

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

ECIA Industry Pulse Index Cools After Five-Year High

ECIA Industry Pulse June 2026 Reaches Five‑Year High

August Index Retreats From June Peak

The overall ECIA component sentiment index declined by 4.9 points month over month to 136.7 in August, down 17.4 points from its June peak of 154.1. Despite this moderation, the reading remains well above the scores recorded during the four-and-a-half years preceding the recent market upswing.

Survey respondents expect the overall index to stay broadly stable in September at 135.4. ECIA’s index uses 100 as the neutral threshold, meaning that readings above 100 indicate improving market conditions and sales sentiment.

Q3 Sales Outlook Stays Positive

The Q3 survey confirms a strong near-term sales outlook across the authorized electronics supply chain. Eighty percent of participants reported growth expectations for Q3 compared with Q2, up from 70 percent in the previous quarterly survey, while only 2 to 3 percent expected declining sentiment.

Among respondents, 31 percent anticipated quarter-to-quarter growth above 5 percent and a further 27 percent expected growth between 3 and 5 percent. Expectations are softer for Q4, but 65 percent of participants still projected quarter-to-quarter growth from Q3 into Q4.

Passive Components Close to Semiconductors

The three major component groups—semiconductors, passive components and electro-mechanical/connectors—showed closely aligned monthly sentiment scores in August and in the September forecast, ranging from 134.2 to 137.5.

On a quarterly basis, 83 percent of respondents expected semiconductor growth, while 76 percent expected growth in passive components. The relatively narrow gap indicates that demand strength is extending beyond semiconductors into capacitors, resistors, inductors, magnetics and other critical bill-of-materials categories.

For designers and sourcing teams, the result reinforces the need to manage strategic components as design parameters rather than purely interchangeable commodities. This is particularly important for application-specific or difficult-to-substitute families such as high-capacitance MLCCs, automotive-qualified components and specialized magnetics; see this passive components in 2026 supply-chain analysis.

Lead-Time Pressure Broadens

Lead-time pressure remained exceptionally high across all three main component categories. Between 70 and 75 percent of survey participants reported increasing lead times, and no respondents reported falling lead times in any product category or sub-category during August.

Although DRAM and data-flash memory availability has received much of the industry’s attention, ECIA noted that the pressure is not limited to memory ICs. The survey indicates a wider supply-chain issue affecting semiconductors, passive components and electro-mechanical products.

This environment calls for a component-family-level sourcing strategy rather than reliance on aggregate market averages. Procurement teams should identify critical components with limited second-source options, validate approved alternates early, review distributor commitments and apply targeted buffers where the operational impact of a shortage exceeds inventory carrying costs. Practical context is available in the Passive Electronic Components Lead-times Update.

End Markets Remain Resilient

End-market sentiment also moderated, falling from 145.0 in July to 138.5 in August, with a further decline to 130.8 projected for September. Nevertheless, all surveyed end markets except mobile phones remained above the 100-point growth threshold in August.

ECIA expects mobile phones to reach the neutral-to-growth threshold in September, which would leave every surveyed end market in positive territory. The broad-based nature of the growth outlook supports continued demand for components across industrial, automotive, computing, communications and consumer-electronics supply chains.

Different Views Across the Channel

Manufacturers reported the strongest sales sentiment in August and also held the most positive view for September. Distributors were considerably more cautious in August but expected to align with the overall market average in September.

Manufacturer representatives were slightly more positive than the market average in August, before slipping modestly below the average in the September outlook. The differences underline the value of cross-checking manufacturer allocation signals, channel inventory and customer demand forecasts before making purchasing commitments.

Further reading

  • ECIA Industry Pulse Index Cools After Five-Year High
  • ECIA Industry Pulse April 2026: Sentiment Cools but Stays Strong
  • Commodity to Design Parameter – Passive Components in 2026
  • Passive Electronic Components Lead-times Update

Source

This article is based on the ECIA Industry Pulse: Electronic Component Trends and Sentiment executive summary for August and Q3 2026, prepared by ECIA Chief Analyst Dale Ford. The survey provides monthly and quarterly visibility into sales expectations, outlook, cancellations, decommits and lead-time conditions across the authorized electronics-component supply chain.

References

  1. ECIA Industry Pulse: Electronic Component Trends and Sentiment — August & Q3 2026 executive summary
  2. ECIA Industry Pulse Index Cools After Five-Year High

Related

Recent Posts

DigiKey product distribution center in Thief River Falls, Minnesota

DigiKey Invests $100 Million to Expand Distribution Capacity

20.10.2026
6
Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
54
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
87
ECIA September 2026 Industry Pulse electronic component trends and sentiment report

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

12.10.2026
36
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
66
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
14
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
71
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
51
DigiKey Factory Tomorrow Season 6 graphic illustrating AI-ready industrial connectivity, data infrastructure and smart manufacturing networks.

DigiKey Factory Tomorrow Season 6 Explores AI-Ready Factories

1.10.2026
10

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved