Page 291 – Passive Components Blog

TI’s EMI-optimized integrated transformer technology miniaturizes isolated power transfer into IC-sized packaging

24.4.2020

Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a ...

KOA Introduces High Power Ceramic Cased Resistors for Automotive Pre-Charge / Discharge

12.2.2020

134

KOA is introducing new range of wire wound and metal oxide high power resistors in ceramic case, dedicated to automotive ...

Murata Completes New Production Facility for Chip Inductors, Noise Filters, and Common Mode Choke Coils

12.2.2020

3

Murata Electronics (Malaysia) Sdn.Bhd. (Perak, Malaysia), a production subsidiary of Murata Manufacturing Co., Ltd., recently completed construction of a production ...

Taiwan passive component makers put more focus on non-China production

12.2.2020

6

Taiwan-based passive component makers will be freeing up non-China production capacity if necessary, as their manufacturing operations in China have ...

Wide Bandgap Materials. Kemet CTO Philip Lessner Discuss the Future of High Power Density, High Efficiency Circuits

11.2.2020

2

Kemet CTO and chief scientist Philip Lessner published on his LinkedIn blog overview of wide gap technologies and Kemet readiness. ...

Würth Elektronik Introduces New Components and New Possibilities at Embedded World

11.2.2020

2

Würth Elektronik, one of Europe’s biggest manufacturers of electronic and electromechanical components, is exhibiting at embedded world (Nuremberg, February 25 ...

Taiyo Yuden Releases 100V 1005-Size Automotive MLCC Ceramic Capacitors

11.2.2020

2

TAIYO YUDEN CO., LTD. announced today the commercialization of 11 products, including the 1005-size multilayer ceramic capacitor HMR105 B7103KV (1.0 ...