Bourns Releases High‑Q Air Coil Inductors for RF Aplications
Bourns has introduced a new family of high‑Q air coil inductors covering multiple package footprints and inductance ranges for RF ...
Bourns has introduced a new family of high‑Q air coil inductors covering multiple package footprints and inductance ranges for RF ...
TJ Green Associates LLC announces the Call for Presentations for the 29th Annual Components for Military & Space Electronics (CMSE) ...
ESA SPCD organizing committee is delighted to announce the Call for Papers for the 6th edition of the International Symposium: ...
Würth Elektronik has extended its WE‑LT conductive textile gasket family with a new halogen‑free variant aimed at enclosure and display ...
Edgewater researchers report that January 26 component distribution recovery takes hold as orders inflect; outlook is improving. What’s Changed/What’s New? ...
Binder has expanded its M8 circular connector portfolio with new flange connectors that use solder bucket terminations instead of pre‑molded ...
Modern power electronics design relies on a diverse toolbox, from general‑purpose circuit simulators to highly specialized magnetics and component‑selection platforms. ...
Modelithics has released a dedicated component model library for SIMULIA CST Studio Suite, bringing its well‑known RF and microwave component ...
Exxelia has released a set of new Micropen white papers with practical insights for printed electronics in medical and sensor ...
Stackpole Electronics has introduced the RMAN series of thick film chip resistors built on aluminum nitride (AlN) substrates, targeting designs ...
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© EPCI - Leading Passive Components Educational and Information Site