Pre-Event Day 7^th September 2021

13:00-17:00 Workshop: Characterization Techniques and Life Cycle Assessment of Materials Involved in Passive Components S.Latorrata, G.Dotelli, L.Primavesi (registration required)

15:30-17:00 Paumanok Market Seminar: Passive Components; Global Market Outlook with monthly updates of key data metrics for 2021; Dennis M Zogbi; Paumanok Inc. 

17:00-19:00 Politecnico di Milano University Tour 

Conference & Networking Day 1 8^th September 2021

9:00-9:30 Welcome prof. Mariapia Pedeferri; Politecnico di Milano and Tomáš Zedníček Ph.D.; EPCI

9:30-9:50 Keynote I.  Passive Components in Europe; EPCIA European Passive Components Industry Association                    

Ralph Bronold; EPCIA president

9:50-10:05 EPCIA Student Awards Ceremony; Ralph Bronold, Christophe Pottier and Thomas Ebel; EPCIA

10:20-10:50 Keynote II. Automotive Requirements for Passive Components; Lorandt Foelkel; Wuerth Elektronik

10:50-11:50 Speakers Introduction

12:40-13:40 Technical Introduction Flash Presentations – 5min short commercial presentations from manufacturers to introduce its hot product / news or invitations to exhibition booth

13:40-15:40 Session 1. MATERIALS & PROCESSES; Chairman: Thomas Ebel

1.1. Design, documentation and test of ESCC Qualified Custom Magnetics by Technology Flow Qualification; Lars Gregersen; Flux A/S; Denmark

1.2. Low Curie Temperature Materials, The Next Generation of High Energy Density Class II Ceramic Dielectrics?; Tomáš Zedníček; EPCI; Czech Republic

1.3. Influence of Sweat on Joints Reliability between SMD Chip Resistors and Conductive Ribbons; Martin Hirman; University of West Bohemia in Pilsen; Czech Republic

1.4. Modified carbon nanotubes and their applications in electronics; Tomáš Blecha; University of West Bohemia in Pilsen; Czech Republic

16:00-18:00 Session 1. (cont.) MATERIALS & PROCESSES; Chairman: Saverio Latorrata

1.5. Reaching the next level of reliability for polymer capacitors; Udo Merker; Heraeus Epurio; Germany

1.6. Using Yield strength and Young’s modulus anode characterisation for prediction of tantalum capacitors’ leakage current stability; Vladimir Azbel; consultant; Israel

1.7. Fabrication of micro-supercapacitor for textile energy storage; Eugenio Gibertini; Politecnico di Milano; Italy

1.8. Comparative Life Cycle Assessment of aluminium electrolytic capacitors; Chiara Moletti; Politecnico di Milano; Italy

18:00     —- Welcome Drink  —-

Panel Discussion & Sessions Day 2 9^th September 2021

9:00-9:30 Keynote III. Is AEQ-200 Becoming the Ultimate Reliability Standard?; Würth Elektronik; Alexander Gerfer; CTO of  Würth Elektronik

9:30-10:30 Hot Topic Panel Discussion Reliability & Sustainability of Passive Components Facilitator: Tomáš Zedníček

Panelists: A.Teverovsky (Jacobs GSFC (NASA), T.Ebel (SDU), A.Gerfer (Würth Elektronik), W.Bruno (KEMET),

10:50-11:50 Session 2. QUALITY & RELIABILITY; Chairman: Vlasta Sedláková

2.1. Reliability and Failure Mode in Solid Tantalum Capacitors; Yuri Freeman; KEMET Electronics; USA

2.2. Reliability Assessment of Cracks in Ceramic Capacitor in Space Condition; Tomáš Zedníček; EPCI; Czech Republic

12:40-13:40 Session 2. (cont.) QUALITY & RELIABILITY; Chairman: Luca Primavesi

2.3. Acceleration Factors for Reliability Assessment of Polymer Tantalum Capacitors; Alexander Teverovsky; Jacobs/ GSFC (NASA); USA

2.4. Supercapacitors: Applications in Space, Development conducted by ESA and challenges to overcome!; Joaquín Jiménez and Leo Farhat; ESA ESTEC; The Netherlands

13:40-14:20 Invited Paper I.: Reliability and simulation of film and aluminum electrolytic capacitors with the latest design tools CLARA and ALCAP; David Olalla & Fabio Mello; TDK; Germany

14:20-14:50 Invited Paper II.: EMC Solutions for new „Power over Coax“ Systems; Uwe Mirschberger; Murata Europe; Germany

15:10-17:10 Session 3. MEASUREMENT AND TEST; Chairman: Lorandt Fölkel

3.1. Overcoming the Challenges of Using Sub-Milliohm SMD Chip Resistors; Stephen Oxley; TT Electronics; UK

3.2. Screening and Qualification of BME feedthrough capacitors for a space project; Aleksander Teverovsky; Jacobs/ GSFC (NASA); USA

3.3. Update on “DC-Bias Aging on MLCCs”; Ladislav Vindiš; Continental; Germany

3.4. Class II MLCCs – More Detailed Classification or More Specific Default Parameters?; Iosif Borcsa; Vitesco; Romania

17:20    Gala Dinner (bus coach to Alfa Romeo Museum and restaurant) —————-

Sessions & Closing Day 3 10^th September 2021

9:00-11:00 Session 4. APPLICATIONS; Chairman: Walter Bruno

4.1. New DC-Link Power Box And Resonant Film Capacitors For High Temperature In Industrial And Automotive Applications; Evangelista Boni; KEMET Electronics; Italy

4.2. Haptics, it used to be all about resonant frequency; Marina Innocenti; KEMET Electronics; USA

4.3. Tantalum Polymer use in GaN based applications; Ron Demcko; AVX Corporation; USA

4.4. Energy Storage Capacitor Technology Comparison and Selection; Daniel West & Ussama Margieh; AVX Corporation; USA

11:20-13:20 Session 5. NEW DEVELOPMENT; Chairman: Thomas Ebel

5.1. New Miniaturized EMI-Suppression and DC-Link Power Box Unique Designs for Harsh Environment in Energy, Industrial and Automotive Applications; Hristina Kostadinova Boshkova; KEMET Electronics; Macedonia

5.2. n-stack-based dielectric films: Future of on-chip capacitors?; Jaromír Hubálek; Brno University of Technology; Czech Republic

5.3. CNF-MIM technology, enabling the worlds thinnest capacitor; Maria Bylund; Smoltek; Sweden

5.4. A way to High Voltage Polymer Aluminium Electrolytic Capacitors; Thomas Ebel; Centre for Industrial Electronics, SDU South Denmark University; Denmark

13:30  Closing Ceremony