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Succesfull PCNS Passive Component Networking Symposium September 10-13th Romania

24.4.2020
Reading Time: 3 mins read
A A
Electronic circuit board with processor, close up.

Electronic circuit board with processor, close up.

Source: EPCI

EPCI European Passive Components Institute organized the 2nd edition of the PCNS Passive Components Networking Days Symposium that took place 10th-13th September 2019 in Bucharest, Romania, hosted by Electronics, Telecommunication and Information Technology Faculty of Politehnica University of Bucharest.

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The PCNS was attended by 63 participants from 15 countries

Program at a Glance

Keynote Presentations:

  • Passive Components – Keys to enabling Advanced Future System Designs; Ron Demcko; Technical Sales Group Manager; AVX fellow
  • Design Challenges of Capacitors – What about downsizing, robustness and energy density for future applications?; Stephan Menzel; Product Development Manager Capacitors; Würth Elektronik eiSos
  • Shortage of Products – Market Mechanisms and How to avoid Fake-Products; Rüdiger Scheel; VP Automotive, Murata Electronics Europe
  • Passive Components – Teaching and Learning; Paul Svasta, Emeritus Professor; Politehnica University of Bucharest

HOT TOPIC Panel Discussion:

MLCC Class II DC BIAS & Ageing Capacitance Loss

  • Manufacturers and end users discussion on definition/reference conditions on capacitance loss with DC BIAS on MLCC class II capacitors
  • Panelists (Tentative list): Valeo, AVX, Kemet, Murata, Continental

Technical Papers:

1. NEW DEVELOPMENT

1.1. A Disruptive Nano-laminate Polymer Capacitor Technology for Electric Drive Applications; Angelo Yializis; POlyCharge America Inc; United States
1.2. Integrated and discrete capacitors based on carbon nanostructures with capacitance densities in excess of 200 nF/mm2; Sascha Krause; Smoltek AB; Sweden
1.3. Advances in Film Resistor Technology; Stephen Oxley; TT Electronics; United Kingdom

2. TECHNOLOGY & ROADMAPS

2.1. Energy Harvesting is not Fiction anymore; Lorandt Fölkel; Würth Elektronik eiSos; Germany
2.2. Analysis of Multi-Layer Ceramic Capacitors used in Power Distribution Networks; Marcel Manofu; Continental; Romania
2.3. Guidelines How to Downsize MLCCs Efficiently; Yuki Nagoshi; Murata; Germany
2.4. Capacitor Trends and Challenges; M. Barta and T.Zednicek; TTI Germany and EPCI Czech Rep.

3. QUALITY & RELIABILITY

3.1. COTS procurement for space mission; Denis Lacombe; ESA ESTEC; Netherlands
3.2. Most Reliable, Most Efficient and Price Effective Solid Tantalum Capacitors; Yuri Freeman and Ed Jones; Kemet; United States
3.3. Real Environment Aluminium Electrolytic Capacitor LifeTime Evaluation and Modelling; Luca Primavesi; ItelCond and Univeristy of Milano; Italy
3.4. Supercapacitor Degradation and Life-time; Vlasta Sedláková; Brno University of Technology; Czech Republic

4. MATERIALS & PROCESSES

4.1. High Bs ferrite material development for high power applications; JC Sun; Power Loss Tester GmbH; Germany
4.2. High efficient new Hybrid magnetic EMI filter design for Low Voltage DC distribution; Wai Keung Mo and Thomas Ebel; Centre for Industrial Electronics, University of Southern Denmark
4.3. Conductive hybrid threads and their applications; Tomas Blecha; University of West Bohemia; Czech Republic
4.4. Tin Whisker or not Whisker; Jean Edmond Le Calvé; Valeo; France
4.5. Stable and reliable tantalum supply chain; Roland Chavasse; T.I.C.; Belgium

5. MEASUREMENT & TEST

5.1. Degradation of Polymer Tantalum Capacitors during High Temperature Storage; Alexander Teverovsky; NASA/GSFC; United States
5.2. Investigation and Experimental Comparison of Magnetic Core Loss for High-Saturation Ferrite Material; Chang Wang; TU of Denmark;Denmark
5.3. Evaluation of Active Balancing Circuits for Supercapacitors; Ciprian Ionescu; Politehnica University of Bucharest, Romania

Download the final program in pdf here:

 

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