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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

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Taiwan Passive Component Materials Vendors Report Strong 1H21

17.3.2021
Reading Time: 2 mins read
A A

Taiwan’s passive component materials suppliers are expected to embrace a particularly strong first-half in 2021 thanks to robust demand for notebook, handset, networking and automotive applications, according to industry sources.

Conductive silver and aluminum paste vendor Ample Electronic Technology (AET), tape and reel packaging materials supplier Lasertek Taiwan, Mn-Zn ferrite cores provider ACME Electronics and ceramic substrate maker Leatec Fine Ceramics saw their January-February revenues grow sharply on year on strong shipments to makers of MLCCs, chip resistors and capacitors despite the Lunar New Year holidays in February, the sources said.

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Besides serving passive component clients, AET also enlists solar cell makers as major downstream clients. To meet increased demand from both segments, AET will boost its conductive paste capacity by 30% in 2021 by installing new machines and clearing manufacturing bottlenecks at its existing production lines, the sources noted.

AET is developing materials for LTCC components in cooperation with clients and is also likely to start commercial production of new conductive paste for LED packaging and other materials for thermal applications in second-half 2021 or early 2022, the sources said.

Lasertek has seen clear order visibility for its tape and reel packaging materials for passive components through the third quarter of 2021, the sources said. The company will move to expand capacity by 10% for high-end materials at its production lines in Taiwan.

Lasertek is set to raise its quotes by 20% starting April after enforcing 5-6% price hikes on its reel packaging materials in late 2020, to reflect continued price increases in raw materials including pulp,the sources said.

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Source: DigiTimes

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